AMD Xilinx
XC2V4000-6FFG1517I
XC2V4000-6FFG1517I ECAD Model
XC2V4000-6FFG1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 912 | |
| Number of Outputs | 912 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V4000-6FFG1517I Datasheet Download
XC2V4000-6FFG1517I Overview
The XC2V4000-6FFG1517I chip model is a powerful and versatile model that has the potential to be used in a wide variety of applications, from networks to intelligent robots. It is a highly advanced chip model, which has the capability to be used in the era of fully intelligent systems.
The XC2V4000-6FFG1517I chip model is designed to be used in various kinds of networks, such as local area networks (LANs) and wide area networks (WANs). It is also suitable for use in intelligent scenarios, such as artificial intelligence (AI) and machine learning (ML). This chip model is capable of processing large amounts of data quickly and accurately, making it an ideal choice for applications that require high-performance computing.
In terms of product description and specific design requirements, the XC2V4000-6FFG1517I chip model is a high-speed, low-power, and low-cost solution. It has a wide range of features, including a high-speed processor, a large memory capacity, and a wide range of peripherals. It is also capable of supporting a variety of operating systems, including Windows, Linux, and Mac OS.
The XC2V4000-6FFG1517I chip model can be used in the development and popularization of future intelligent robots. It is a powerful and versatile model that can be used to create robots that can perform a wide range of tasks, from simple tasks such as cleaning and sorting to more complex tasks such as navigation and object recognition. In order to use the XC2V4000-6FFG1517I chip model effectively, individuals must possess technical knowledge in the areas of computer science, robotics, and AI.
In conclusion, the XC2V4000-6FFG1517I chip model is a powerful and versatile model that has the potential to be used in a wide variety of applications, from networks to intelligent robots. It is a highly advanced chip model, which has the capability to be used in the era of fully intelligent systems. Furthermore, it can be used in the development and popularization of future intelligent robots, and individuals must possess technical knowledge in the areas of computer science, robotics, and AI in order to use the model effectively.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||