
AMD Xilinx
XC2V4000-6FFG1152I
XC2V4000-6FFG1152I ECAD Model
XC2V4000-6FFG1152I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 824 | |
Number of Outputs | 824 | |
Number of Logic Cells | 51840 | |
Number of Equivalent Gates | 4000000 | |
Number of CLBs | 5760 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5760 CLBS, 4000000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
Pin Count | 1152 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2V4000-6FFG1152I Datasheet Download
XC2V4000-6FFG1152I Overview
The chip model XC2V4000-6FFG1152I is a very important product in the chip industry. It is widely used in various industries, such as communication, automotive, industrial, consumer electronics and so on. With the development of intelligent technology, the chip model XC2V4000-6FFG1152I has become more and more important.
In terms of industry trends, the chip model XC2V4000-6FFG1152I is becoming more and more popular. It is widely used in various industries, such as communication, automotive, industrial, consumer electronics and so on. The chip model XC2V4000-6FFG1152I is a very powerful chip, which can support a variety of applications. It can provide a high-performance platform for the development of intelligent products.
In terms of future development, the chip model XC2V4000-6FFG1152I can be used in many advanced communication systems. It can provide a high-performance platform for the development of intelligent products. The chip model XC2V4000-6FFG1152I can also be applied to networks, and it can be used in the era of fully intelligent systems. It is possible to use the chip model XC2V4000-6FFG1152I in various intelligent scenarios.
In terms of the original design intention of the chip model XC2V4000-6FFG1152I, it is designed to provide a high-performance platform for the development of intelligent products. It is also possible to upgrade the chip model XC2V4000-6FFG1152I in the future, so that it can support more advanced technologies.
To sum up, the chip model XC2V4000-6FFG1152I is a very important product in the chip industry. It is widely used in various industries, such as communication, automotive, industrial, consumer electronics and so on. With the development of intelligent technology, the chip model XC2V4000-6FFG1152I has become more and more important. In terms of industry trends, the chip model XC2V4000-6FFG1152I is becoming more and more popular. In terms of future development, the chip model XC2V4000-6FFG1152I can be used in many advanced communication systems and can be applied to networks. It is also possible to upgrade the chip model XC2V4000-6FFG1152I in the future, so that it can support more advanced technologies. Whether the application environment requires the support of new technologies or not, it depends on what specific technologies are needed.
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