XC2V4000-6FFG1152I
XC2V4000-6FFG1152I
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rohs

AMD Xilinx

XC2V4000-6FFG1152I


XC2V4000-6FFG1152I
F20-XC2V4000-6FFG1152I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152

XC2V4000-6FFG1152I ECAD Model


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XC2V4000-6FFG1152I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 824
Number of Outputs 824
Number of Logic Cells 51840
Number of Equivalent Gates 4000000
Number of CLBs 5760
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 5760 CLBS, 4000000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
Pin Count 1152
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2V4000-6FFG1152I Datasheet Download


XC2V4000-6FFG1152I Overview



The chip model XC2V4000-6FFG1152I is a very important product in the chip industry. It is widely used in various industries, such as communication, automotive, industrial, consumer electronics and so on. With the development of intelligent technology, the chip model XC2V4000-6FFG1152I has become more and more important.


In terms of industry trends, the chip model XC2V4000-6FFG1152I is becoming more and more popular. It is widely used in various industries, such as communication, automotive, industrial, consumer electronics and so on. The chip model XC2V4000-6FFG1152I is a very powerful chip, which can support a variety of applications. It can provide a high-performance platform for the development of intelligent products.


In terms of future development, the chip model XC2V4000-6FFG1152I can be used in many advanced communication systems. It can provide a high-performance platform for the development of intelligent products. The chip model XC2V4000-6FFG1152I can also be applied to networks, and it can be used in the era of fully intelligent systems. It is possible to use the chip model XC2V4000-6FFG1152I in various intelligent scenarios.


In terms of the original design intention of the chip model XC2V4000-6FFG1152I, it is designed to provide a high-performance platform for the development of intelligent products. It is also possible to upgrade the chip model XC2V4000-6FFG1152I in the future, so that it can support more advanced technologies.


To sum up, the chip model XC2V4000-6FFG1152I is a very important product in the chip industry. It is widely used in various industries, such as communication, automotive, industrial, consumer electronics and so on. With the development of intelligent technology, the chip model XC2V4000-6FFG1152I has become more and more important. In terms of industry trends, the chip model XC2V4000-6FFG1152I is becoming more and more popular. In terms of future development, the chip model XC2V4000-6FFG1152I can be used in many advanced communication systems and can be applied to networks. It is also possible to upgrade the chip model XC2V4000-6FFG1152I in the future, so that it can support more advanced technologies. Whether the application environment requires the support of new technologies or not, it depends on what specific technologies are needed.



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