AMD Xilinx
XC2V4000-6FF1517I
XC2V4000-6FF1517I ECAD Model
XC2V4000-6FF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 912 | |
| Number of Outputs | 912 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1517 |
XC2V4000-6FF1517I Datasheet Download
XC2V4000-6FF1517I Overview
The chip model XC2V4000-6FF1517I is a high-performance, low-cost FPGA from Xilinx. It is designed to meet the needs of various applications, from basic to advanced communication systems. This model has many advantages, such as its high-speed operation, its ability to support various types of I/O, and its low power consumption. It is also equipped with a large number of configurable logic blocks and RAM blocks, making it suitable for a wide range of applications.
In terms of the expected demand trends for the XC2V4000-6FF1517I, the chip is expected to be increasingly adopted by industries such as aerospace, automotive, and industrial automation. As these industries become increasingly reliant on advanced communication systems, the XC2V4000-6FF1517I will be a preferred choice due to its low cost and high performance.
The original design intention of the XC2V4000-6FF1517I was to provide a low-cost, high-performance FPGA that could support various types of I/O and configurable logic blocks. This makes it suitable for a wide range of applications, from basic to advanced communication systems. It also has the potential for future upgrades, such as increased speed, improved power efficiency, and additional features.
In terms of possible future applications of the XC2V4000-6FF1517I, the chip is expected to be increasingly adopted by industries such as aerospace, automotive, and industrial automation. It is also likely to be used in networks and intelligent scenarios, such as in the era of fully intelligent systems. The chip has the potential to be used in a variety of applications, including autonomous vehicles, artificial intelligence, and robotics.
Overall, the XC2V4000-6FF1517I is an ideal chip for a variety of applications, from basic to advanced communication systems. Its low cost, high performance, and potential for future upgrades make it an attractive option for a wide range of industries. It is also likely to be increasingly adopted in networks and intelligent scenarios, making it a great choice for the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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