AMD Xilinx
XC2V4000-6FF1517C
XC2V4000-6FF1517C ECAD Model
XC2V4000-6FF1517C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 912 | |
| Number of Outputs | 912 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.A |
XC2V4000-6FF1517C Datasheet Download
XC2V4000-6FF1517C Overview
The XC2V4000-6FF1517C chip model is a powerful, high-performance model that is suitable for a variety of digital signal processing, embedded processing, and image processing applications. It is designed to be programmed with the HDL (Hardware Description Language) and is capable of performing complex tasks with ease. This makes it an ideal choice for a wide range of projects, from embedded systems and industrial automation to medical and aerospace applications.
The XC2V4000-6FF1517C chip model is also an excellent choice for networks and intelligent scenarios. It is capable of handling complex tasks such as machine learning, speech recognition, and image processing with ease. This makes it a perfect choice for the development of intelligent systems and robots. The chip model can be used to create systems that are capable of performing complex tasks with minimal human intervention.
In order to effectively use the XC2V4000-6FF1517C chip model, one must have a strong understanding of HDL programming and the underlying hardware. It is also important to have a good grasp of the various algorithms and techniques used in machine learning and image processing. Additionally, knowledge of the various operating systems and platforms that the chip model is compatible with is required.
The XC2V4000-6FF1517C chip model is a powerful and versatile tool that can be used to create a wide range of intelligent systems and robots. With the right technical skills and knowledge, it is possible to create systems that are capable of performing complex tasks with minimal human intervention. This makes the chip model an ideal choice for the development and popularization of future intelligent robots.
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