
AMD Xilinx
XC2V4000-6FF1152I
XC2V4000-6FF1152I ECAD Model
XC2V4000-6FF1152I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 824 | |
Number of Outputs | 824 | |
Number of Logic Cells | 51840 | |
Number of Equivalent Gates | 4000000 | |
Number of CLBs | 5760 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5760 CLBS, 4000000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
Pin Count | 1152 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2V4000-6FF1152I Datasheet Download
XC2V4000-6FF1152I Overview
The XC2V4000-6FF1152I chip model is a high-performance, low-power, field programmable gate array (FPGA) device developed by Xilinx. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This model is equipped with 6,000 logic cells and 1,152 Flip-Flops, and its power consumption is only 4.5 watts. It features a large number of IO pins, a wide range of operating temperatures, and a low cost.
The XC2V4000-6FF1152I chip model has a number of advantages that make it an attractive choice for many applications. It has a high-performance processor core that is capable of executing complex instructions quickly and accurately. It also has a wide range of peripherals and interfaces, making it suitable for a variety of applications. In addition, the FPGA device is highly programmable and can be customized to meet specific needs.
The XC2V4000-6FF1152I chip model is expected to be increasingly in demand in the coming years. With its low power consumption, high performance, and wide range of features, it is ideal for many applications, including embedded systems, image processing, and digital signal processing. In addition, its low cost makes it an attractive option for many industries.
The XC2V4000-6FF1152I chip model can also be used in the development and popularization of future intelligent robots. Its high performance processor core and wide range of peripherals and interfaces make it a suitable choice for robotics applications. In addition, its low power consumption makes it an ideal choice for powering robots. To use the model effectively, technical expertise in HDL language programming, embedded systems, and image processing is required.
In conclusion, the XC2V4000-6FF1152I chip model is a high-performance, low-power, field programmable gate array device that is suitable for a wide range of applications. It has a number of advantages, including a high-performance processor core, a wide range of peripherals and interfaces, and a low cost. It is expected to be increasingly in demand in the coming years, and can be used in the development and popularization of future intelligent robots. To use the model effectively, technical expertise in HDL language programming, embedded systems, and image processing is required.
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