AMD Xilinx
XC2V4000-6FF1152C
XC2V4000-6FF1152C ECAD Model
XC2V4000-6FF1152C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 824 | |
| Number of Outputs | 824 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2V4000-6FF1152C Datasheet Download
XC2V4000-6FF1152C Overview
The chip model XC2V4000-6FF1152C is an innovative, high-performance chip that is suitable for a variety of applications, including digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, which is a powerful and widely used programming language for creating complex digital systems.
Given the chip's high performance and versatility, it is well-suited for use in a variety of network and intelligent scenarios. For example, it can be used to build high-speed networks that can support large amounts of data traffic. It can also be used to create intelligent systems that can process large amounts of data quickly and accurately. Additionally, it can be used in the development and popularization of future intelligent robots, as it is capable of handling complex tasks with speed and accuracy.
Using the chip model XC2V4000-6FF1152C effectively requires a certain level of technical expertise. Those who want to use the chip must be familiar with the HDL language and have a thorough understanding of the chip's features and capabilities. Additionally, they must have a good grasp of the latest trends in robotics and artificial intelligence in order to make the most of the chip's potential.
In conclusion, the chip model XC2V4000-6FF1152C is a powerful and versatile chip that is suitable for a variety of applications. It is well-suited for use in networks and intelligent scenarios, and can be used in the development and popularization of future intelligent robots. To use the model effectively, however, requires a certain level of technical expertise. Those who are interested in using the chip must be familiar with the HDL language and have a good understanding of the chip's features and capabilities.
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5,203 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $647.2800 | $647.2800 |
| 10+ | $640.3200 | $6,403.2000 |
| 100+ | $605.5200 | $60,552.0000 |
| 1000+ | $570.7200 | $285,360.0000 |
| 10000+ | $522.0000 | $522,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||