AMD Xilinx
XC2V4000-4FF1517C
XC2V4000-4FF1517C ECAD Model
XC2V4000-4FF1517C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 912 | |
| Number of Outputs | 912 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1 MM PITCH, MS-034AAU-1, FLIP CHIP, FBGA-1517 | |
| Pin Count | 1517 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2V4000-4FF1517C Datasheet Download
XC2V4000-4FF1517C Overview
The chip model XC2V4000-4FF1517C is an advanced integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing. With its high-performance and reliable features, it is suitable for a variety of applications, such as in communication systems. It is designed to be used with the HDL language, which is a hardware description language used to create digital logic designs.
The original design intention of the chip model XC2V4000-4FF1517C was to create a powerful and reliable IC that could be used in a variety of applications. It was designed to be able to handle high-performance digital signal processing, embedded processing, and image processing tasks, and it is capable of future upgrades and expansions. This makes it suitable for use in advanced communication systems, as it can be easily upgraded and adapted to new technologies.
The chip model XC2V4000-4FF1517C can also be used for the development and popularization of future intelligent robots. Its powerful features and reliable performance make it ideal for use in robotics applications. To use the model effectively, it requires the use of technical talents such as engineers with knowledge of HDL language and robotics.
In conclusion, the chip model XC2V4000-4FF1517C is a powerful and reliable integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It can be used in advanced communication systems and for the development and popularization of future intelligent robots. To use the model effectively, it requires the use of technical talents such as engineers with knowledge of HDL language and robotics.
You May Also Be Interested In
5,154 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $651.0000 | $651.0000 |
| 10+ | $644.0000 | $6,440.0000 |
| 100+ | $609.0000 | $60,900.0000 |
| 1000+ | $574.0000 | $287,000.0000 |
| 10000+ | $525.0000 | $525,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||