AMD Xilinx
XC2V4000-4FF1152C
XC2V4000-4FF1152C ECAD Model
XC2V4000-4FF1152C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 824 | |
| Number of Outputs | 824 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | |
| Pin Count | 1152 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.A |
XC2V4000-4FF1152C Datasheet Download
XC2V4000-4FF1152C Overview
The Xilinx XC2V4000-4FF1152C chip model is a revolutionary development in the field of Field Programmable Gate Arrays (FPGAs). It is developed by Xilinx, a leading company in the field of programmable logic devices. This chip model is designed with the intention of providing a powerful yet cost-effective solution for a wide range of applications. It offers high-performance, low-power consumption, and a wide range of features that make it suitable for a range of applications.
The XC2V4000-4FF1152C chip model is an advanced FPGA that has been designed to meet the needs of modern applications. It is capable of providing high-speed data processing, low power consumption, and a wide range of features. The chip model is capable of supporting a variety of communication protocols, such as Ethernet, USB, and Wi-Fi. It is also capable of supporting a wide range of digital signal processing (DSP) applications. In addition, it is capable of supporting a wide range of digital logic functions, such as logic synthesis, logic verification, and digital logic design.
The XC2V4000-4FF1152C chip model is an ideal solution for a wide range of applications. It is suitable for applications that require high-speed data processing, low power consumption, and a wide range of features. It is also suitable for applications that require advanced communication systems. This chip model is capable of supporting a variety of communication protocols, such as Ethernet, USB, and Wi-Fi. It is also capable of supporting a wide range of digital signal processing (DSP) applications. In addition, it is capable of supporting a wide range of digital logic functions, such as logic synthesis, logic verification, and digital logic design.
In terms of industry trends, the XC2V4000-4FF1152C chip model is expected to be in high demand in the near future. This is due to its advanced features and its ability to meet the needs of a wide range of applications. This chip model is expected to be used in a variety of applications, such as industrial automation, medical electronics, and consumer electronics. Furthermore, the chip model is expected to be used in a variety of communication systems, such as cellular networks, wireless LANs, and satellite communications.
In terms of future development, the XC2V4000-4FF1152C chip model is expected to be upgraded in the future. This is due to its advanced features and its ability to meet the needs of a wide range of applications. This chip model is expected to be upgraded with new technologies that will enable it to support a variety of communication protocols, such as Ethernet, USB, and Wi-Fi. It is also expected to be upgraded with new digital signal processing (DSP) applications. Furthermore, it is expected to be upgraded with new digital logic functions, such as logic synthesis, logic verification, and digital logic design.
In conclusion, the Xilinx XC2V4000-4FF1152C chip model is a revolutionary development in the field of Field Programmable Gate Arrays (FPGAs). It is capable of providing high-speed data processing, low power consumption, and a wide range of features. It is suitable for applications that require advanced communication systems, such as cellular networks, wireless LANs, and satellite communications. Furthermore, the chip model is expected to be upgraded in the future with new technologies that will enable it to support a variety of communication protocols, such as Ethernet, USB, and Wi-Fi. It is also expected to be upgraded with new digital signal processing (DSP) applications and new digital logic functions, such as logic synthesis, logic verification, and digital logic design.
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4,051 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $637.9800 | $637.9800 |
| 10+ | $631.1200 | $6,311.2000 |
| 100+ | $596.8200 | $59,682.0000 |
| 1000+ | $562.5200 | $281,260.0000 |
| 10000+ | $514.5000 | $514,500.0000 |
| The price is for reference only, please refer to the actual quotation! | ||