AMD Xilinx
XC2V3000-6FG676I
XC2V3000-6FG676I ECAD Model
XC2V3000-6FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 484 | |
| Number of Outputs | 484 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V3000-6FG676I Datasheet Download
XC2V3000-6FG676I Overview
The chip model XC2V3000-6FG676I is a revolutionary chip model that has been developed by a leading chip manufacturing company, offering an advanced solution for the ever-evolving technology industry. It is designed to provide superior performance and reliability for a wide range of applications, from consumer electronics to industrial automation.
The chip model XC2V3000-6FG676I offers a number of advantages that make it the ideal choice for many applications. It is equipped with a high-speed processor, allowing for faster and more efficient processing of data. It also features advanced memory technology, allowing for more data storage and retrieval. Additionally, it is designed to be energy efficient, providing an improved level of power consumption and lower overall costs.
The chip model XC2V3000-6FG676I is expected to be in high demand in the future, as the technology industry continues to evolve and become more integrated. It is expected to be used in a wide range of applications, from consumer electronics to industrial automation. Additionally, it is expected to be used in networks and intelligent scenarios, as more companies and organizations seek to take advantage of the latest technologies.
The chip model XC2V3000-6FG676I is also expected to be used in the era of fully intelligent systems. This will require the support of new technologies, such as artificial intelligence, machine learning, and deep learning. These technologies will allow for more efficient and effective processing of data and more accurate decision making. Additionally, these technologies will enable the chip model XC2V3000-6FG676I to be used in a wide range of applications and scenarios, from consumer electronics to industrial automation.
In conclusion, the chip model XC2V3000-6FG676I is a revolutionary chip model that is expected to be in high demand in the future, as the technology industry continues to evolve and become more integrated. It is expected to be used in a wide range of applications, from consumer electronics to industrial automation. Additionally, it is expected to be used in networks and intelligent scenarios, as more companies and organizations seek to take advantage of the latest technologies. Furthermore, it is expected to be used in the era of fully intelligent systems, requiring the support of new technologies such as artificial intelligence, machine learning, and deep learning.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||