AMD Xilinx
XC2V3000-6FG676C
XC2V3000-6FG676C ECAD Model
XC2V3000-6FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 484 | |
| Number of Outputs | 484 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V3000-6FG676C Datasheet Download
XC2V3000-6FG676C Overview
The chip model XC2V3000-6FG676C is a powerful and reliable integrated circuit (IC) that has been designed to meet the needs of a variety of applications. It is a versatile device that can be used in a wide range of applications, including networking, intelligent systems, and other demanding tasks. The chip model XC2V3000-6FG676C is a high-performance IC that is designed to deliver maximum performance and reliability.
In terms of industry trends, the chip model XC2V3000-6FG676C is designed to meet the demands of the emerging trend of intelligent systems. It is capable of providing the necessary support for the development of new technologies and applications that are being developed for intelligent systems. As such, the chip model XC2V3000-6FG676C is well-suited for applications that require the support of new technologies.
The chip model XC2V3000-6FG676C is also suitable for use in networks, providing the necessary support for the development of new applications and services. It is capable of providing the necessary support for the development of new technologies and applications that are being developed for networks. As such, the chip model XC2V3000-6FG676C is well-suited for applications that require the support of new technologies.
In terms of its product description, the chip model XC2V3000-6FG676C is designed to deliver maximum performance and reliability. It has a wide range of features, including a high-speed processor, high-speed memory, and a wide range of communication protocols. Additionally, the chip model XC2V3000-6FG676C is designed to be compatible with a variety of operating systems, allowing it to be used in a wide range of applications.
When it comes to actual case studies and precautions, the chip model XC2V3000-6FG676C is designed to be reliable and durable. It is designed to be able to withstand a variety of environmental conditions, including temperature variations, humidity, and other environmental conditions. Additionally, the chip model XC2V3000-6FG676C is designed to be able to withstand a variety of power sources, including AC and DC power sources.
In conclusion, the chip model XC2V3000-6FG676C is a versatile and reliable IC that is designed to meet the needs of a variety of applications. It is designed to be able to provide the necessary support for the development of new technologies and applications that are being developed for intelligent systems and networks. Additionally, the chip model XC2V3000-6FG676C is designed to be reliable and durable, and is capable of withstanding a variety of environmental conditions and power sources.
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5,942 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $364.5600 | $364.5600 |
| 10+ | $360.6400 | $3,606.4000 |
| 100+ | $341.0400 | $34,104.0000 |
| 1000+ | $321.4400 | $160,720.0000 |
| 10000+ | $294.0000 | $294,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||