AMD Xilinx
XC2V2000-5FG676C
XC2V2000-5FG676C ECAD Model
XC2V2000-5FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 456 | |
| Number of Outputs | 456 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V2000-5FG676C Datasheet Download
XC2V2000-5FG676C Overview
The XC2V2000-5FG676C chip model is a powerful and versatile device that can be used in a variety of applications, ranging from high-performance digital signal processing to embedded processing and image processing. It is designed to be used with the HDL language, giving users the ability to quickly and easily program the chip for their specific needs.
The original design intention of the XC2V2000-5FG676C was to provide a powerful and reliable solution for digital signal processing, embedding, and image processing. With its powerful architecture, the chip model is capable of handling complex tasks, making it an ideal choice for high-performance applications. It also has the potential to be upgraded in the future, allowing users to take advantage of the latest technology and capabilities.
The XC2V2000-5FG676C can also be used in the development and popularization of future intelligent robots. With its powerful architecture, the chip model is capable of handling complex tasks, making it an ideal choice for advanced communication systems. To use the model effectively, technical talents such as software engineers, hardware engineers, and data scientists are needed. These professionals will be able to use the chip model to its full potential and create powerful robots that can be used in a variety of applications.
Overall, the XC2V2000-5FG676C chip model is a powerful and versatile device that can be used in a variety of applications. With its original design intention, potential for future upgrades, and ability to be used in the development and popularization of future intelligent robots, the chip model can be used effectively with the help of the right technical talents.
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3,596 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $603.9235 | $603.9235 |
| 10+ | $597.4297 | $5,974.2969 |
| 100+ | $564.9607 | $56,496.0687 |
| 1000+ | $532.4917 | $266,245.8410 |
| 10000+ | $487.0351 | $487,035.0750 |
| The price is for reference only, please refer to the actual quotation! | ||