AMD Xilinx
XC2V3000-5FG676C
XC2V3000-5FG676C ECAD Model
XC2V3000-5FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 484 | |
| Number of Outputs | 484 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2V3000-5FG676C Datasheet Download
XC2V3000-5FG676C Overview
The XC2V3000-5FG676C chip model is a state-of-the-art integrated circuit that is suitable for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The chip is highly versatile and offers a variety of features and advantages, including a low power consumption, high speed, and a small form factor.
The XC2V3000-5FG676C chip model is designed to meet the needs of the modern digital world. It is capable of handling complex tasks with ease and can be used in a variety of industries. This makes it an ideal choice for applications such as industrial automation, medical equipment, and consumer electronics. The chip is also suitable for use in robotics, automotive, and aerospace applications.
The XC2V3000-5FG676C chip model is also highly reliable and secure. It is designed with advanced security features such as encryption and anti-tampering capabilities. This ensures that the data stored on the chip is secure and cannot be accessed by unauthorized users. The chip also offers a range of features that make it suitable for use in a wide range of applications.
The XC2V3000-5FG676C chip model is expected to be in high demand in the future. As the need for more powerful and efficient computing solutions increases, the demand for this chip model is expected to rise. This is due to its versatility, reliability, and security features. Additionally, the chip is designed to be compatible with a variety of operating systems and hardware platforms, making it a great choice for any application.
The XC2V3000-5FG676C chip model is also expected to benefit from the development of new technologies. As the world becomes more connected, the need for faster and more efficient computing solutions increases. This means that the chip model will need to be able to support new technologies in order to remain competitive. This could include the use of artificial intelligence, blockchain, and quantum computing.
Overall, the XC2V3000-5FG676C chip model is an excellent choice for a variety of applications. It offers a range of features and advantages that make it suitable for use in a variety of industries. Additionally, the chip is expected to remain in high demand in the future as new technologies are developed and the need for more powerful and efficient computing solutions increases.
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1,165 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $312.4800 | $312.4800 |
| 10+ | $309.1200 | $3,091.2000 |
| 100+ | $292.3200 | $29,232.0000 |
| 1000+ | $275.5200 | $137,760.0000 |
| 10000+ | $252.0000 | $252,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||