AMD Xilinx
XC2V2000-6FG676I
XC2V2000-6FG676I ECAD Model
XC2V2000-6FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 456 | |
| Number of Outputs | 456 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V2000-6FG676I Datasheet Download
XC2V2000-6FG676I Overview
The chip model XC2V2000-6FG676I is a highly advanced integrated circuit that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language, a hardware description language, to program the chip. This makes it a powerful tool for engineers and developers who need to create complex systems.
The chip model XC2V2000-6FG676I is capable of handling a wide variety of tasks, such as digital signal processing, embedded processing, image processing, and more. It is also highly reliable, making it a great choice for mission-critical applications. As the demand for more powerful computing systems increases, the XC2V2000-6FG676I is well-positioned to meet this need.
The industry trends for the chip model XC2V2000-6FG676I are likely to continue in the direction of increased performance and reliability. As more complex systems are developed, the need for powerful and reliable integrated circuits will only increase. Additionally, the use of HDL language to program the chip will become more important as the complexity of systems increases.
The future applications of the XC2V2000-6FG676I in networks and intelligent scenarios are vast. It could be used in a variety of applications, such as autonomous vehicles, smart homes, and more. Additionally, with the development of fully intelligent systems, the XC2V2000-6FG676I could be used to power these systems. As the capabilities of the chip model increase, so too will its applications.
In conclusion, the chip model XC2V2000-6FG676I is a powerful and reliable integrated circuit that is suitable for a wide range of applications. It requires the use of HDL language to program the chip, and its performance and reliability are likely to continue to increase. Additionally, its future applications in networks and intelligent scenarios are vast, and it could be used to power the era of fully intelligent systems.
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2,885 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $348.1920 | $348.1920 |
| 10+ | $344.4480 | $3,444.4800 |
| 100+ | $325.7280 | $32,572.8000 |
| 1000+ | $307.0080 | $153,504.0000 |
| 10000+ | $280.8000 | $280,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||