AMD Xilinx
XC2V250-5FG256C
XC2V250-5FG256C ECAD Model
XC2V250-5FG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 172 | |
| Number of Outputs | 172 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V250-5FG256C Datasheet Download
XC2V250-5FG256C Overview
The Xilinx XC2V250-5FG256C chip model is a Field-Programmable Gate Array (FPGA) that is designed for a wide range of applications. It is a versatile and powerful device that can be used in a variety of different systems, including advanced communication systems.
The XC2V250-5FG256C chip model is equipped with a large number of features that make it suitable for a wide range of applications. It has a high-speed, low-power design, with up to 256K logic cells, up to 16K RAM blocks, and up to 8K I/O pins. It also has a high-performance, low-power, low-cost design, with a wide range of features, such as a high-speed, low-power, low-cost design, and a wide range of I/O options.
The original design intention of the XC2V250-5FG256C chip model was to provide a versatile and powerful device that could be used in a variety of different applications. It was designed to be a cost-effective solution for applications that require a high-speed, low-power, low-cost design. It can be used in a wide range of applications, including advanced communication systems.
The XC2V250-5FG256C chip model is also designed to be upgradeable, allowing for future upgrades to the device. This allows for the device to be used in more advanced applications, as well as providing more functionality. The device can also be upgraded to support more advanced features, such as higher speed, higher power, and more I/O options.
The XC2V250-5FG256C chip model is a versatile and powerful device that can be used in a variety of applications. However, it is important to note that the device is not suitable for all applications. It is important to review the product description and specific design requirements of the XC2V250-5FG256C chip model before using it in any application. This will ensure that the device is used correctly and safely.
In addition, actual case studies and precautions should be taken into account when using the XC2V250-5FG256C chip model. This will ensure that the device is used correctly and safely, and that any potential risks are minimized.
The XC2V250-5FG256C chip model can also be used in the development and popularization of future intelligent robots. This device is equipped with a wide range of features that make it suitable for a wide range of applications, including advanced communication systems. However, it is important to note that the device is not suitable for all applications. It is important to have the necessary technical talents and knowledge to use the device effectively. This includes understanding the product description and specific design requirements of the XC2V250-5FG256C chip model, as well as taking into account actual case studies and precautions.
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