AMD Xilinx
XC2V250-4FG256C
XC2V250-4FG256C ECAD Model
XC2V250-4FG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 172 | |
| Number of Outputs | 172 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V250-4FG256C Datasheet Download
XC2V250-4FG256C Overview
The chip model XC2V250-4FG256C is a small, low-cost, low-power field-programmable gate array (FPGA) from Xilinx. It is designed for use in applications such as communications, data processing, and embedded systems. The chip model is a versatile, cost-effective solution for a wide range of applications, offering a high level of flexibility and scalability.
The chip model XC2V250-4FG256C is designed to be capable of handling a variety of tasks, and it is also designed to be easily upgradable. The chip model has a wide range of features, including a high-speed, low-power architecture, integrated memory controllers, and an advanced system-level design environment. This makes it well suited for use in a variety of applications, including communications, data processing, and embedded systems.
The chip model XC2V250-4FG256C is also suitable for use in the development and popularization of future intelligent robots. The chip model is capable of handling a variety of tasks, and it is also designed to be easily upgradable. This makes it well suited for use in a variety of applications, including communications, data processing, and embedded systems. In addition, the chip model is capable of integrating a variety of sensors and actuators, allowing for the development of more advanced robotic systems.
In order to effectively use the chip model XC2V250-4FG256C, it is important to have a good understanding of the underlying technology. This includes a knowledge of the architecture of the chip model, as well as the programming language used to program it. In addition, it is important to have a good understanding of the design environment and the associated tools. This will help to ensure that the chip model is being used effectively and efficiently.
The chip model XC2V250-4FG256C is a versatile and cost-effective solution for a wide range of applications. It is designed to be capable of handling a variety of tasks, and it is also designed to be easily upgradable. This makes it well suited for use in a variety of applications, including communications, data processing, and embedded systems. In addition, it is suitable for use in the development and popularization of future intelligent robots. In order to effectively use the chip model, it is important to have a good understanding of the underlying technology and the associated tools. With this knowledge, the chip model can be used to its fullest potential, allowing for the development of more advanced applications and systems.
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2,330 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $38.8740 | $38.8740 |
| 10+ | $38.4560 | $384.5600 |
| 100+ | $36.3660 | $3,636.6000 |
| 1000+ | $34.2760 | $17,138.0000 |
| 10000+ | $31.3500 | $31,350.0000 |
| The price is for reference only, please refer to the actual quotation! | ||