AMD Xilinx
XC2V2000-4FG676C
XC2V2000-4FG676C ECAD Model
XC2V2000-4FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 456 | |
| Number of Outputs | 456 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V2000-4FG676C Datasheet Download
XC2V2000-4FG676C Overview
The XC2V2000-4FG676C is a field-programmable gate array (FPGA) chip model that has been designed by Xilinx, a leading manufacturer in the field of programmable logic devices. It is a highly versatile and powerful chip that can be used in a variety of applications, ranging from consumer electronics to industrial automation.
The XC2V2000-4FG676C is a very cost-effective solution for a wide range of applications, as it offers a high level of performance and can be used in a variety of different environments. The chip model is designed to be highly efficient, with low power consumption, and is optimized for use in high-speed applications. It is also capable of supporting a wide range of communication protocols, such as Ethernet, USB, and PCI Express.
The XC2V2000-4FG676C is a highly configurable chip, with a wide range of features and capabilities that can be used to create a variety of different applications. It is capable of supporting a wide range of communication protocols, as well as a variety of different types of memory and storage. It is also capable of supporting a variety of different types of peripherals, such as cameras and displays.
In terms of future industry trends, the XC2V2000-4FG676C is likely to remain a popular choice for a wide range of applications. As new technologies become available, such as 5G and Wi-Fi 6, the chip model is likely to be adapted to support these new technologies. Additionally, with the increasing demand for faster and more reliable communication systems, the XC2V2000-4FG676C is likely to remain a popular choice for these types of applications.
In terms of design considerations, the XC2V2000-4FG676C is a highly configurable chip, and it is important to consider the specific application requirements when designing a system that uses this chip model. It is important to consider the communication protocols that will be used, as well as the type of memory and storage that will be required. Additionally, it is important to consider the type of peripherals that will be used, as well as the power consumption requirements of the system.
Finally, it is important to consider any potential upgrades or modifications that may be needed in the future. The XC2V2000-4FG676C is a highly configurable chip, and it is possible to make modifications to the chip in order to support new technologies or to improve its performance. It is also possible to upgrade the chip to a newer version in order to take advantage of any new features or capabilities that may be available.
In conclusion, the XC2V2000-4FG676C is a highly versatile and powerful chip model that is suitable for a wide range of applications. It is capable of supporting a wide range of communication protocols, as well as a variety of different types of memory and storage. Additionally, it is possible to make modifications or upgrades to the chip in order to take advantage of new technologies or to improve its performance. It is important to consider the specific application requirements when designing a system that uses this chip model, as well as any potential upgrades or modifications that may be needed in the future.
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3,906 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $162.7500 | $162.7500 |
| 10+ | $161.0000 | $1,610.0000 |
| 100+ | $152.2500 | $15,225.0000 |
| 1000+ | $143.5000 | $71,750.0000 |
| 10000+ | $131.2500 | $131,250.0000 |
| The price is for reference only, please refer to the actual quotation! | ||