AMD Xilinx
XC2V1500-6FG676I
XC2V1500-6FG676I ECAD Model
XC2V1500-6FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 392 | |
| Number of Outputs | 392 | |
| Number of Logic Cells | 17280 | |
| Number of Equivalent Gates | 1500000 | |
| Number of CLBs | 1920 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1920 CLBS, 1500000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V1500-6FG676I Datasheet Download
XC2V1500-6FG676I Overview
The XC2V1500-6FG676I is a highly advanced chip model that has been developed to meet the needs of the modern technology industry. This chip model is designed to provide high performance and reliability in a wide range of applications. It is a versatile model that can be used in a variety of industries, including communications, aerospace, automotive, and medical.
The XC2V1500-6FG676I chip model is designed to offer a range of advantages for users. It is a low-power, high-performance model that is capable of providing fast data processing and reliable operation. Additionally, this chip model has a high level of integration, allowing for multiple functions to be integrated into a single chip. This allows for a more efficient and cost-effective design.
The XC2V1500-6FG676I chip model also has an impressive range of features that make it an ideal choice for a variety of applications. It is equipped with a range of communication protocols, such as Ethernet, USB, and Serial, that allow for easy integration into existing systems. Additionally, this chip model is designed to be highly scalable, allowing for future upgrades and modifications. It also has a wide range of security features, such as encryption and authentication, that make it a secure choice for sensitive applications.
The XC2V1500-6FG676I chip model is designed to meet the needs of modern communication systems. It is capable of providing high-speed data transfer and reliable performance. Additionally, this chip model is designed to be easily integrated into existing systems and is capable of providing a wide range of features, such as encryption and authentication. Additionally, this chip model is designed to be highly scalable, allowing for future upgrades and modifications.
The XC2V1500-6FG676I chip model is a versatile model that can be used in a variety of industries, including communications, aerospace, automotive, and medical. It is designed to offer a range of advantages for users, such as low-power consumption, high-performance, and high integration. Additionally, this chip model is designed to be highly scalable, allowing for future upgrades and modifications.
When designing systems with the XC2V1500-6FG676I chip model, it is important to take into account the specific design requirements of the chip model. It is important to consider the power consumption, the operating temperature, and the frequency of the chip model. Additionally, it is important to consider the communication protocols that the chip model is designed to support and the security features that are included.
The XC2V1500-6FG676I chip model is a highly advanced model that has been designed to meet the needs of the modern technology industry. It is designed to offer a range of advantages for users, such as low-power consumption, high-performance, and high integration. Additionally, this chip model is designed to be highly scalable, allowing for future upgrades and modifications. With its impressive range of features and scalability, the XC2V1500-6FG676I chip model is expected to become increasingly popular in a variety of industries in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||