AMD Xilinx
XC2V1500-6FG676C
XC2V1500-6FG676C ECAD Model
XC2V1500-6FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 392 | |
| Number of Outputs | 392 | |
| Number of Logic Cells | 17280 | |
| Number of Equivalent Gates | 1500000 | |
| Number of CLBs | 1920 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1920 CLBS, 1500000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V1500-6FG676C Datasheet Download
XC2V1500-6FG676C Overview
The chip model XC2V1500-6FG676C is a high performance programmable logic device, mainly used in digital signal processing, embedded processing, image processing and other applications. It is designed to be programmed with a hardware description language (HDL), such as VHDL or Verilog, which makes it highly flexible and allows for easy upgrades and modifications.
The XC2V1500-6FG676C chip model is a great choice for advanced communication systems due to its high speed, low power consumption and high flexibility. With its high performance, it can be used for various data processing tasks, such as packet switching, routing, and encryption. It can also be used for image and video processing, allowing for real-time image recognition and analysis. Furthermore, it can be used for intelligent control systems, such as robotics, and can be programmed to carry out complex tasks.
The XC2V1500-6FG676C chip model is also suitable for advanced communication systems in the era of fully intelligent systems. It can be used for various tasks, such as natural language processing, machine learning, and deep learning. It can be used to enable autonomous systems to make decisions based on the data collected from their environment. Furthermore, it can be used for edge computing, allowing for the processing of large amounts of data in a distributed manner.
The XC2V1500-6FG676C chip model is a great choice for advanced communication systems due to its high performance and flexibility. It can be used for various tasks, such as data processing, image processing, intelligent control systems, and natural language processing. Furthermore, it can be used for edge computing, allowing for the distributed processing of large amounts of data. With its high performance and flexibility, the XC2V1500-6FG676C chip model is suitable for the era of fully intelligent systems.
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