AMD Xilinx
XC2V1500-5FG676C
XC2V1500-5FG676C ECAD Model
XC2V1500-5FG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 392 | |
| Number of Outputs | 392 | |
| Number of Logic Cells | 17280 | |
| Number of Equivalent Gates | 1500000 | |
| Number of CLBs | 1920 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1920 CLBS, 1500000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V1500-5FG676C Datasheet Download
XC2V1500-5FG676C Overview
The chip model XC2V1500-5FG676C is a cutting-edge technology in the semiconductor industry. It is a field-programmable gate array (FPGA) chip developed by Xilinx, a leading provider of programmable logic solutions. The XC2V1500-5FG676C offers a wide range of features, including a high-speed, low-power architecture, a high-performance processor, and a large number of programmable logic blocks. It also has a very small form factor, making it ideal for use in a variety of applications.
The XC2V1500-5FG676C chip has been widely adopted in many industries, ranging from aerospace and defense to automotive and consumer electronics. It has been used to create a variety of intelligent systems, from industrial robots to autonomous vehicles. In addition, the chip is also being used in the development of artificial intelligence (AI) and machine learning (ML) applications.
The XC2V1500-5FG676C chip has many advantages over other FPGA chips. It offers a high-performance processor, a large number of programmable logic blocks, and a low-power architecture. This makes it ideal for use in applications that require high-speed and low-power operation. It also has a very small form factor, making it ideal for use in a variety of applications.
The XC2V1500-5FG676C chip is expected to continue to be in demand in the future. As the development of AI and ML applications continues to grow, the demand for high-performance FPGA chips will also continue to grow. In addition, the chip is also expected to be used in the development of autonomous vehicles and other intelligent systems.
The XC2V1500-5FG676C chip can also be used to develop and popularize future intelligent robots. The chip has the capability to process large amounts of data quickly, which makes it ideal for use in robotics applications. In addition, the chip also has the ability to control motors, making it useful for creating robots that can move around. However, in order to use the chip effectively, it is important to have a good understanding of the chip's architecture and how to program it. Technical talents with a good understanding of the chip's architecture and programming are needed in order to use the chip effectively.
In conclusion, the XC2V1500-5FG676C chip is a cutting-edge technology in the semiconductor industry. It has many advantages over other FPGA chips, making it ideal for use in a variety of applications. The chip is expected to continue to be in demand in the future, as the development of AI and ML applications continues to grow. In addition, the chip can also be used to develop and popularize future intelligent robots. However, in order to use the chip effectively, it is important to have a good understanding of the chip's architecture and how to program it. Technical talents with a good understanding of the chip's architecture and programming are needed in order to use the chip effectively.
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3,091 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $247.9008 | $247.9008 |
| 10+ | $245.2352 | $2,452.3520 |
| 100+ | $231.9072 | $23,190.7200 |
| 1000+ | $218.5792 | $109,289.6000 |
| 10000+ | $199.9200 | $199,920.0000 |
| The price is for reference only, please refer to the actual quotation! | ||