AMD Xilinx
XC2V1000-6FG256I
XC2V1000-6FG256I ECAD Model
XC2V1000-6FG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 172 | |
| Number of Outputs | 172 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V1000-6FG256I Datasheet Download
XC2V1000-6FG256I Overview
The XC2V1000-6FG256I chip model is a high-performance, low-cost integrated circuit designed for digital signal processing, embedded processing, and image processing. It is built with a field-programmable gate array (FPGA) architecture, allowing for easy customization and scalability. This chip model is designed to be used with a hardware description language (HDL), making it a perfect choice for high-performance applications.
The original design intention of the XC2V1000-6FG256I chip model was to provide a reliable and cost-effective digital signal processing solution for a wide variety of applications. Its flexibility and scalability make it a great choice for any application that requires high-performance computing. Additionally, it is designed to be future-proof, allowing for upgrades and modifications as needed.
The XC2V1000-6FG256I chip model can also be used in advanced communication systems. It is capable of processing large amounts of data at high speeds, making it ideal for applications such as 5G networks and other high-speed communication systems. It is also capable of being used in intelligent scenarios, such as autonomous vehicles and robots. In the future, the XC2V1000-6FG256I chip model will be an essential component of fully intelligent systems, providing the processing power needed to make these systems a reality.
In conclusion, the XC2V1000-6FG256I chip model is a powerful, low-cost solution for digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language, making it a great choice for high-performance applications. Additionally, it is capable of being used in advanced communication systems and intelligent scenarios, making it a great choice for the future. With its flexibility and scalability, the XC2V1000-6FG256I chip model is an ideal choice for any application.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||