AMD Xilinx
XC2V1000-6FG256C
XC2V1000-6FG256C ECAD Model
XC2V1000-6FG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 172 | |
| Number of Outputs | 172 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V1000-6FG256C Datasheet Download
XC2V1000-6FG256C Overview
The chip model XC2V1000-6FG256C is a high-performance programmable logic device designed to meet the needs of a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, etc., and requires the use of HDL language. Its advantages include a wide range of features, high performance, and low power consumption.
The chip model XC2V1000-6FG256C is gaining popularity in the industry due to its versatility and efficiency. It is widely used in a variety of applications such as high-performance control systems, industrial automation, medical imaging, and automotive electronics. It is also increasingly being used in the development of embedded systems and robotics.
The chip model XC2V1000-6FG256C is expected to be in high demand in the future, as the need for high-performance, low-power solutions increases. Additionally, the demand for new technologies to support the chip model's application environment is also expected to rise, as companies look for ways to leverage the chip model's capabilities.
The chip model XC2V1000-6FG256C is a powerful tool that can help companies increase their efficiency and reduce their costs. As such, it is expected to remain popular in the industry in the years to come. It is also expected to be used in the development of new technologies, as companies look for ways to make use of the chip model's capabilities. This will help to drive the industry forward, as companies look for ways to stay ahead of the competition.
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4,025 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $95.7571 | $95.7571 |
| 10+ | $94.7274 | $947.2743 |
| 100+ | $89.5792 | $8,957.9202 |
| 1000+ | $84.4310 | $42,215.4860 |
| 10000+ | $77.2235 | $77,223.4500 |
| The price is for reference only, please refer to the actual quotation! | ||