AMD Xilinx
XC2V1000-4FG256C
XC2V1000-4FG256C ECAD Model
XC2V1000-4FG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 172 | |
| Number of Outputs | 172 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V1000-4FG256C Datasheet Download
XC2V1000-4FG256C Overview
The Xilinx XC2V1000-4FG256C is a field-programmable gate array (FPGA) chip that has been widely adopted in a variety of industries. It is known for its high-performance, low-power consumption, and low cost. This chip has been used in a variety of applications, ranging from embedded systems to industrial automation.
The XC2V1000-4FG256C is a versatile chip, capable of supporting a wide variety of technologies. It is designed with a high-performance architecture that allows for the implementation of complex algorithms and designs. It is also designed with a low-power consumption, which makes it suitable for use in energy-sensitive applications. Additionally, the chip has a low cost, making it an attractive option for a variety of applications.
In terms of industry trends, the XC2V1000-4FG256C is likely to remain popular in the foreseeable future. This is due to its versatility, low cost, and low power consumption. It is also suitable for use in a variety of applications, including embedded systems, industrial automation, and networking. Additionally, the chip is capable of supporting new technologies, such as artificial intelligence, machine learning, and the Internet of Things (IoT).
In terms of possible future applications, the XC2V1000-4FG256C is well-suited for use in networking applications. It is capable of handling complex algorithms and designs, allowing it to be used in a variety of intelligent scenarios. Additionally, the chip is capable of supporting the latest technologies, making it suitable for use in the era of fully intelligent systems.
When considering the product description and specific design requirements of the XC2V1000-4FG256C, it is important to consider the application environment. This includes the type of application, the required performance, and the power consumption requirements. Additionally, it is important to consider the specific features of the chip, such as its clock speed, memory size, and I/O capabilities. Additionally, it is important to consider the specific design requirements, such as the timing constraints, power budget, and other design constraints.
Finally, it is important to consider actual case studies and precautions when using the XC2V1000-4FG256C. This includes considering the potential risks associated with using the chip, such as potential hardware or software failures. Additionally, it is important to consider the potential security risks associated with using the chip, such as potential malicious code or viruses. Additionally, it is important to consider the potential environmental risks associated with using the chip, such as potential radiation or electromagnetic interference.
In conclusion, the XC2V1000-4FG256C is a versatile chip that is suitable for a variety of applications. It is capable of supporting a wide variety of technologies, making it suitable for use in a variety of intelligent scenarios. Additionally, it is important to consider the product description, design requirements, case studies, and precautions when using the XC2V1000-4FG256C.
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1,847 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $69.7500 | $69.7500 |
| 10+ | $69.0000 | $690.0000 |
| 100+ | $65.2500 | $6,525.0000 |
| 1000+ | $61.5000 | $30,750.0000 |
| 10000+ | $56.2500 | $56,250.0000 |
| The price is for reference only, please refer to the actual quotation! | ||