AMD Xilinx
XQ4VLX60-10FF668M
XQ4VLX60-10FF668M ECAD Model
XQ4VLX60-10FF668M Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 59904 | |
| Number of CLBs | 6656 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6656 CLBS | |
| Clock Frequency-Max | 1.028 GHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B668 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 668 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA668,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-668 | |
| Pin Count | 668 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ4VLX60-10FF668M Datasheet Download
XQ4VLX60-10FF668M Overview
The XQ4VLX60-10FF668M chip model is a versatile, high-performance digital signal processor that can be used in a variety of applications, including embedded processing, image processing, and more. It is designed to be used with a hardware description language (HDL), making it a powerful tool for developers.
The XQ4VLX60-10FF668M chip model has several advantages that make it attractive to developers. It is capable of high-speed operation, providing fast processing speeds for complex tasks. It also has a low power consumption, allowing it to be used in embedded applications with minimal energy requirements. Additionally, the chip model is designed to be easily integrated into existing systems, making it a great choice for developers looking to upgrade their systems without having to start from scratch.
The XQ4VLX60-10FF668M chip model is expected to be in high demand in the future, as more and more industries are turning to digital signal processing and embedded processing solutions. It is likely that the chip model will be used in a variety of applications, including robotics and other forms of artificial intelligence.
The XQ4VLX60-10FF668M chip model can certainly be applied to the development and popularization of future intelligent robots. However, it will require the use of specialized technical skills in order to use the model effectively. Engineers and developers need to be familiar with HDL and have a good understanding of the chip model in order to get the most out of it. Additionally, a good understanding of robotics and artificial intelligence is needed in order to develop and deploy intelligent robots that use the chip model.
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