AMD Xilinx
XQ4VLX60-10EF668M
XQ4VLX60-10EF668M ECAD Model
XQ4VLX60-10EF668M Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 59904 | |
| Number of CLBs | 6656 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6656 CLBS | |
| Clock Frequency-Max | 1.028 GHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B668 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 668 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA668,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-668 | |
| Pin Count | 668 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ4VLX60-10EF668M Datasheet Download
XQ4VLX60-10EF668M Overview
The XQ4VLX60-10EF668M chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL (Hardware Description Language) which is a language that allows users to describe the behavior of the chip. This chip model is capable of running complex tasks in a fraction of the time required by traditional methods.
The XQ4VLX60-10EF668M chip model has several advantages over other similar models. It is capable of processing large amounts of data quickly and accurately, and it is highly reliable and robust. Additionally, it is energy efficient, meaning that it requires less power to run compared to other chip models. This makes it ideal for applications that require a lot of processing power.
The XQ4VLX60-10EF668M chip model is expected to be in high demand in the future, especially in the fields of embedded processing and image processing. As technology advances and more complex tasks become possible, the demand for powerful chips like the XQ4VLX60-10EF668M will only increase. Additionally, the chip model is expected to be used in a variety of networks and intelligent scenarios. It may be used in the future as part of fully intelligent systems, such as artificial intelligence and machine learning.
The XQ4VLX60-10EF668M chip model is a powerful tool that is capable of running complex tasks in a fraction of the time required by traditional methods. It is highly reliable and energy efficient, making it ideal for applications that require a lot of processing power. Additionally, it is expected to be in high demand in the future as technology advances and more complex tasks become possible. Finally, it may be used in a variety of networks and intelligent scenarios, including fully intelligent systems such as artificial intelligence and machine learning.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||