AMD Xilinx
XQ4VLX40-10FF668I
XQ4VLX40-10FF668I ECAD Model
XQ4VLX40-10FF668I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 640 | |
| Number of Outputs | 640 | |
| Number of Logic Cells | 41472 | |
| Number of CLBs | 4608 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4608 CLBS | |
| Clock Frequency-Max | 1.028 GHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B668 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 668 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA668,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-668 | |
| Pin Count | 668 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XQ4VLX40-10FF668I Datasheet Download
XQ4VLX40-10FF668I Overview
The XQ4VLX40-10FF668I chip model is a powerful and versatile tool for many industries. It is designed to be a high-performance, low-cost solution for a variety of applications. This chip model offers a wide range of features, such as a wide operating temperature range, low power consumption, and high speed. It has the ability to support multiple types of memory and data transfer protocols. This makes it ideal for a variety of applications, such as industrial automation, embedded systems, and communication systems.
The demand for the XQ4VLX40-10FF668I chip model is expected to grow in the future as the need for more advanced and reliable solutions increases. It can be used for a variety of applications, including industrial automation, embedded systems, and communication systems. The chip model has the potential to be used in the development and popularization of future intelligent robots, as it can provide the necessary processing power and data transfer protocols.
The original design intention of the XQ4VLX40-10FF668I chip model was to provide a low-cost solution for a variety of applications. It was designed to be a high-performance, low-cost solution that can be used in a variety of applications. The chip model has the potential to be upgraded in the future, as new technologies become available.
The XQ4VLX40-10FF668I chip model can be applied to the development and popularization of future intelligent robots. It can provide the necessary processing power and data transfer protocols for the development of robots. In order to use the model effectively, technical talents such as software engineers and hardware engineers are needed to develop and maintain the chip model.
In conclusion, the XQ4VLX40-10FF668I chip model is a powerful and versatile tool for many industries. It is designed to be a high-performance, low-cost solution for a variety of applications. The demand for the chip model is expected to grow in the future, and it has the potential to be upgraded in the future. It can be applied to the development and popularization of future intelligent robots, and technical talents such as software engineers and hardware engineers are needed to use the model effectively.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||