
AMD Xilinx
XQ4VLX25-10FF668M
XQ4VLX25-10FF668M ECAD Model
XQ4VLX25-10FF668M Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 448 | |
Number of Outputs | 448 | |
Number of Logic Cells | 24192 | |
Number of CLBs | 2688 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2688 CLBS | |
Clock Frequency-Max | 1.028 GHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B668 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 668 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA668,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FCBGA-668 | |
Pin Count | 668 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQ4VLX25-10FF668M Datasheet Download
XQ4VLX25-10FF668M Overview
The chip model XQ4VLX25-10FF668M is a cutting edge technology in the semiconductor industry, offering a range of features and benefits for its users. This model is based on the Xilinx Virtex-4 platform and provides a high performance, low power solution for a variety of applications. It features a 10-bit wide, low-voltage differential signaling (LVDS) interface, which allows for high speed data transfer with minimal power consumption. Additionally, it offers a wide range of memory options, including DDR2, DDR3 and QDR SRAM, allowing for the design of a wide range of systems.
The XQ4VLX25-10FF668M has many advantages over other chip models and is expected to be in high demand in the future. It has a low power consumption and a high performance, making it ideal for applications that require both. Additionally, it has a wide range of memory options, allowing for the design of a wide range of systems. It also has a wide range of features, including a 10-bit wide, low-voltage differential signaling (LVDS) interface, allowing for high speed data transfer with minimal power consumption. Finally, it has a small form factor, making it suitable for a variety of applications.
The product description and specific design requirements of the XQ4VLX25-10FF668M are detailed in the product datasheet. The datasheet provides information on the chip's features, specifications, and design requirements. It also includes a list of actual case studies and precautions that should be taken when designing a system with the chip.
In terms of the industry trends of the XQ4VLX25-10FF668M and the future development of related industries, it is expected that the demand for the chip will continue to grow due to its advantages and features. Furthermore, the application environment may require the support of new technologies, depending on the specific needs of the system. For example, if the system requires high speed data transfer, then the LVDS interface of the chip may be the best solution.
Overall, the XQ4VLX25-10FF668M is an advanced chip model that offers a range of features and benefits for its users. It has a low power consumption and a high performance, making it ideal for applications that require both. Additionally, it has a wide range of memory options, allowing for the design of a wide range of systems. Furthermore, its 10-bit wide, low-voltage differential signaling (LVDS) interface allows for high speed data transfer with minimal power consumption. It is expected that the demand for the chip will continue to grow in the future, and the application environment may require the support of new technologies, depending on the specific needs of the system.
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