XQ4VLX25-10FF668M
XQ4VLX25-10FF668M
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XQ4VLX25-10FF668M


XQ4VLX25-10FF668M
F20-XQ4VLX25-10FF668M
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FCBGA-668
FCBGA-668

XQ4VLX25-10FF668M ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XQ4VLX25-10FF668M Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 448
Number of Outputs 448
Number of Logic Cells 24192
Number of CLBs 2688
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 2688 CLBS
Clock Frequency-Max 1.028 GHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B668
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 668
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA668,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FCBGA-668
Pin Count 668
Reach Compliance Code not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01

XQ4VLX25-10FF668M Datasheet Download


XQ4VLX25-10FF668M Overview



The chip model XQ4VLX25-10FF668M is a cutting edge technology in the semiconductor industry, offering a range of features and benefits for its users. This model is based on the Xilinx Virtex-4 platform and provides a high performance, low power solution for a variety of applications. It features a 10-bit wide, low-voltage differential signaling (LVDS) interface, which allows for high speed data transfer with minimal power consumption. Additionally, it offers a wide range of memory options, including DDR2, DDR3 and QDR SRAM, allowing for the design of a wide range of systems.


The XQ4VLX25-10FF668M has many advantages over other chip models and is expected to be in high demand in the future. It has a low power consumption and a high performance, making it ideal for applications that require both. Additionally, it has a wide range of memory options, allowing for the design of a wide range of systems. It also has a wide range of features, including a 10-bit wide, low-voltage differential signaling (LVDS) interface, allowing for high speed data transfer with minimal power consumption. Finally, it has a small form factor, making it suitable for a variety of applications.


The product description and specific design requirements of the XQ4VLX25-10FF668M are detailed in the product datasheet. The datasheet provides information on the chip's features, specifications, and design requirements. It also includes a list of actual case studies and precautions that should be taken when designing a system with the chip.


In terms of the industry trends of the XQ4VLX25-10FF668M and the future development of related industries, it is expected that the demand for the chip will continue to grow due to its advantages and features. Furthermore, the application environment may require the support of new technologies, depending on the specific needs of the system. For example, if the system requires high speed data transfer, then the LVDS interface of the chip may be the best solution.


Overall, the XQ4VLX25-10FF668M is an advanced chip model that offers a range of features and benefits for its users. It has a low power consumption and a high performance, making it ideal for applications that require both. Additionally, it has a wide range of memory options, allowing for the design of a wide range of systems. Furthermore, its 10-bit wide, low-voltage differential signaling (LVDS) interface allows for high speed data transfer with minimal power consumption. It is expected that the demand for the chip will continue to grow in the future, and the application environment may require the support of new technologies, depending on the specific needs of the system.



3,383 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote