AMD Xilinx
XCV50-6FG256I
XCV50-6FG256I ECAD Model
XCV50-6FG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-6FG256I Datasheet Download
XCV50-6FG256I Overview
The chip model XCV50-6FG256I is a highly advanced, reliable, and cost-effective semiconductor device that has been developed for the purpose of providing advanced, high-performance computing capabilities. The chip model is designed to support a wide range of applications, including embedded systems, consumer electronics, and industrial automation. It features a 6-stage pipeline, 256-bit memory bus, and a wide range of I/O interfaces.
The XCV50-6FG256I is a powerful chip model that offers high performance and flexibility. It is designed to be used in a wide range of applications, from embedded systems to consumer electronics, and is ideal for applications that require high-performance and reliability. The chip model is designed to be highly power-efficient and is capable of providing up to 25% lower power consumption compared to other similar chips. It is also designed to be highly reliable, with a minimum of 99.9% reliability.
The XCV50-6FG256I is designed to be highly versatile and can be used in a wide range of applications. It can be used in industrial automation, consumer electronics, and embedded systems. It is also designed to be highly scalable, allowing for the development of new applications and technologies as needed. The chip model is also designed to be highly cost-effective, allowing for the development of new applications and technologies at a lower cost.
The XCV50-6FG256I is a highly advanced chip model that offers a wide range of features and capabilities. It is designed to be highly reliable, power-efficient, and cost-effective. It is also designed to be highly scalable and versatile, allowing for the development of new applications and technologies as needed. The chip model is expected to see increasing demand in the future, as more applications and technologies are developed for it.
In order to ensure that the XCV50-6FG256I is used in the optimal environment, it is important to understand the product description and design requirements of the chip model. It is also important to understand the actual case studies and precautions associated with the chip model. This will help to ensure that the chip model is used in the most efficient and reliable way possible.
Overall, the XCV50-6FG256I is a powerful and reliable chip model that offers a wide range of features and capabilities. It is designed to be highly reliable, power-efficient, and cost-effective. It is also designed to be highly scalable and versatile, allowing for the development of new applications and technologies as needed. The chip model is expected to see increasing demand in the future, as more applications and technologies are developed for it. In order to ensure that the XCV50-6FG256I is used in the optimal environment, it is important to understand the product description and design requirements of the chip model, as well as the actual case studies and precautions associated with the chip model.
You May Also Be Interested In
3,880 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $71.4954 | $71.4954 |
| 10+ | $70.7267 | $707.2666 |
| 100+ | $66.8828 | $6,688.2816 |
| 1000+ | $63.0390 | $31,519.4880 |
| 10000+ | $57.6576 | $57,657.6000 |
| The price is for reference only, please refer to the actual quotation! | ||