XCV200-6FG256I
XCV200-6FG256I
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rohs

AMD Xilinx

XCV200-6FG256I


XCV200-6FG256I
F20-XCV200-6FG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-256
FBGA-256

XCV200-6FG256I ECAD Model


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XCV200-6FG256I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Inputs 176
Number of Outputs 176
Number of Logic Cells 5292
Number of Equivalent Gates 236666
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 236666 GATES
Clock Frequency-Max 333 MHz
Power Supplies 1.2/3.6,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCV200-6FG256I Datasheet Download


XCV200-6FG256I Overview



The XCV200-6FG256I chip model is designed to be a powerful, versatile, and cost-effective solution for a wide range of applications. Developed by Xilinx, this chip model is a field programmable gate array (FPGA) that offers the flexibility and performance of an ASIC with the reprogrammability of a microcontroller. It is based on the Virtex-6 family of FPGAs and includes up to 256 6-input look-up tables (LUTs) for logic functions.


The XCV200-6FG256I chip model can be used for advanced communication systems, such as 5G networks and Internet of Things (IoT) applications. It is also suitable for applications in the era of fully intelligent systems, such as artificial intelligence (AI), machine learning (ML), and deep learning (DL). With its high-performance logic and DSP capabilities, the XCV200-6FG256I chip model can be used to develop and popularize future intelligent robots.


The XCV200-6FG256I chip model is designed to be flexible and can be upgraded in the future to meet the changing needs of applications. It is also designed to be power efficient, which makes it an ideal solution for applications that require low power consumption. To use the XCV200-6FG256I chip model effectively, technical talents such as software engineers, hardware engineers, and embedded system developers are required.


In conclusion, the XCV200-6FG256I chip model is a powerful, versatile, and cost-effective solution for a wide range of applications. It can be used for advanced communication systems, as well as for the development and popularization of future intelligent robots. It is also designed to be flexible and can be upgraded in the future to meet the changing needs of applications. To use the XCV200-6FG256I chip model effectively, technical talents such as software engineers, hardware engineers, and embedded system developers are required.



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1+ $50.5920 $50.5920
10+ $50.0480 $500.4800
100+ $47.3280 $4,732.8000
1000+ $44.6080 $22,304.0000
10000+ $40.8000 $40,800.0000
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