
AMD Xilinx
XCV200-6FG256I
XCV200-6FG256I ECAD Model
XCV200-6FG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 176 | |
Number of Outputs | 176 | |
Number of Logic Cells | 5292 | |
Number of Equivalent Gates | 236666 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 236666 GATES | |
Clock Frequency-Max | 333 MHz | |
Power Supplies | 1.2/3.6,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCV200-6FG256I Datasheet Download
XCV200-6FG256I Overview
The XCV200-6FG256I chip model is designed to be a powerful, versatile, and cost-effective solution for a wide range of applications. Developed by Xilinx, this chip model is a field programmable gate array (FPGA) that offers the flexibility and performance of an ASIC with the reprogrammability of a microcontroller. It is based on the Virtex-6 family of FPGAs and includes up to 256 6-input look-up tables (LUTs) for logic functions.
The XCV200-6FG256I chip model can be used for advanced communication systems, such as 5G networks and Internet of Things (IoT) applications. It is also suitable for applications in the era of fully intelligent systems, such as artificial intelligence (AI), machine learning (ML), and deep learning (DL). With its high-performance logic and DSP capabilities, the XCV200-6FG256I chip model can be used to develop and popularize future intelligent robots.
The XCV200-6FG256I chip model is designed to be flexible and can be upgraded in the future to meet the changing needs of applications. It is also designed to be power efficient, which makes it an ideal solution for applications that require low power consumption. To use the XCV200-6FG256I chip model effectively, technical talents such as software engineers, hardware engineers, and embedded system developers are required.
In conclusion, the XCV200-6FG256I chip model is a powerful, versatile, and cost-effective solution for a wide range of applications. It can be used for advanced communication systems, as well as for the development and popularization of future intelligent robots. It is also designed to be flexible and can be upgraded in the future to meet the changing needs of applications. To use the XCV200-6FG256I chip model effectively, technical talents such as software engineers, hardware engineers, and embedded system developers are required.
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2,898 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $50.5920 | $50.5920 |
10+ | $50.0480 | $500.4800 |
100+ | $47.3280 | $4,732.8000 |
1000+ | $44.6080 | $22,304.0000 |
10000+ | $40.8000 | $40,800.0000 |
The price is for reference only, please refer to the actual quotation! |