AMD Xilinx
XCV300E-8FG256I
XCV300E-8FG256I ECAD Model
XCV300E-8FG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV300E-8FG256I Datasheet Download
XCV300E-8FG256I Overview
The Xilinx XCV300E-8FG256I is a field-programmable gate array (FPGA) chip designed to meet the needs of a wide range of applications. It is a reliable, cost-effective, and high-performance FPGA solution that is suitable for both established and emerging applications. The XCV300E-8FG256I is a versatile chip that provides high-speed signal processing, advanced communication systems, and powerful networking capabilities.
The original design intention of the XCV300E-8FG256I was to provide a cost-effective, reliable, and high-performance solution for a wide range of applications. It is designed to be easily upgradeable and can be used for advanced communication systems and networks. The chip is capable of supporting multiple protocols, making it suitable for a variety of applications. It also provides high-speed signal processing, powerful networking capabilities, and advanced communication systems.
The XCV300E-8FG256I is a versatile chip that can be used for a variety of applications, including intelligent scenarios. It is capable of supporting multiple protocols and can be used in the era of fully intelligent systems. It is also designed to be easily upgradeable, allowing for future upgrades and modifications. The chip is also designed to be reliable and cost-effective, making it suitable for a variety of applications.
The product description of the XCV300E-8FG256I outlines the specific design requirements and features of the chip. It is designed to be easily upgradeable and can be used for advanced communication systems and networks. The chip is also capable of supporting multiple protocols, making it suitable for a variety of applications. It also provides high-speed signal processing, powerful networking capabilities, and advanced communication systems.
When using the XCV300E-8FG256I, it is important to consider the actual case studies and precautions. It is important to ensure that the chip is properly configured and that the necessary protocols are supported. Additionally, it is important to ensure that the chip is properly powered and that it is not subjected to any extreme temperatures or environmental conditions. It is also important to ensure that the chip is properly maintained and that any necessary upgrades or modifications are performed in a timely manner.
In conclusion, the Xilinx XCV300E-8FG256I is a reliable, cost-effective, and high-performance FPGA chip designed to meet the needs of a wide range of applications. It is designed to be easily upgradeable and can be used for advanced communication systems and networks. The chip is capable of supporting multiple protocols, making it suitable for a variety of applications. It also provides high-speed signal processing, powerful networking capabilities, and advanced communication systems. It is important to consider the actual case studies and precautions when using the XCV300E-8FG256I.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $346.9086 | $346.9086 |
| 10+ | $343.1784 | $3,431.7840 |
| 100+ | $324.5274 | $32,452.7400 |
| 1000+ | $305.8764 | $152,938.2000 |
| 10000+ | $279.7650 | $279,765.0000 |
| The price is for reference only, please refer to the actual quotation! | ||