AMD Xilinx
XCV200E-8FG256I
XCV200E-8FG256I ECAD Model
XCV200E-8FG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV200E-8FG256I Datasheet Download
XCV200E-8FG256I Overview
The XCV200E-8FG256I chip model is a powerful and versatile processor that is suitable for a variety of applications. Its primary use is in high-performance digital signal processing, embedded processing, and image processing. The chip model is designed to be used with HDL (Hardware Description Language) to make it easier to program and debug.
The XCV200E-8FG256I chip model has several advantages. It is a single-chip solution, meaning it is more cost-effective than a multi-chip solution. It also has a high-speed clock frequency of up to 500MHz, which makes it ideal for high-performance applications. The chip model also has a large memory capacity of up to 256MB, making it suitable for large-scale applications.
The demand for the XCV200E-8FG256I chip model is expected to increase in the coming years as more applications require high-performance processors. This chip model is particularly well-suited for applications in the automotive, aerospace, and medical industries. These industries require high-performance processors that can handle large amounts of data and complex algorithms.
The XCV200E-8FG256I chip model can be used in the development and popularization of future intelligent robots. This chip model has the power and flexibility to handle the complex algorithms and data processing that are necessary for robots to perform their tasks. In order to use the XCV200E-8FG256I chip model effectively, technical talents with knowledge of HDL language and experience in programming and debugging are necessary.
Overall, the XCV200E-8FG256I chip model is a powerful and versatile processor that is suitable for a variety of applications. It has a high-speed clock frequency, large memory capacity, and is cost-effective. The demand for this chip model is expected to increase in the coming years, and it can be used in the development and popularization of future intelligent robots. Technical talents with knowledge of HDL language and experience in programming and debugging are necessary to use the model effectively.
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4,357 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $37.2000 | $37.2000 |
| 10+ | $36.8000 | $368.0000 |
| 100+ | $34.8000 | $3,480.0000 |
| 1000+ | $32.8000 | $16,400.0000 |
| 10000+ | $30.0000 | $30,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||