AMD Xilinx
XCV2000E-8FGG860I
XCV2000E-8FGG860I ECAD Model
XCV2000E-8FGG860I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV2000E-8FGG860I Datasheet Download
XCV2000E-8FGG860I Overview
The chip model XCV2000E-8FGG860I is a high-performance, low-power, low-cost and versatile programmable logic device. It is designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications. It is based on the Xilinx Virtex-5 FPGA technology, and it requires the use of HDL language.
The original design intention of the chip model XCV2000E-8FGG860I is to provide a powerful and cost-effective solution for various applications. It has the flexibility to support the development of a wide range of applications, including high-speed digital signal processing, embedded processing, image processing, and more. The device also has the potential to be upgraded in the future, allowing for the possibility of more advanced applications.
The chip model XCV2000E-8FGG860I is also suitable for use in advanced communication systems. It can be used to develop and popularize future intelligent robots, as well as other robotics applications. To use the model effectively, technical talents such as engineers, computer scientists, and software developers are needed. They need to be familiar with HDL language and have the necessary knowledge and experience to design and develop complex systems.
In conclusion, the chip model XCV2000E-8FGG860I is a powerful, low-cost, and versatile programmable logic device that is suitable for a wide range of applications. It has the potential to be upgraded in the future, and it can be used to develop and popularize future intelligent robots. To use the model effectively, technical talents such as engineers, computer scientists, and software developers are needed.
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