AMD Xilinx
XCV2000E-6FGG860I
XCV2000E-6FGG860I ECAD Model
XCV2000E-6FGG860I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV2000E-6FGG860I Datasheet Download
XCV2000E-6FGG860I Overview
Chip model XCV2000E-6FGG860I is a cutting-edge technology that has been gaining traction in the industry in recent years. It is a versatile chip model that is designed to meet the needs of various applications. This model is designed with the latest technologies, allowing it to be used in a wide range of scenarios.
The XCV2000E-6FGG860I chip model is designed to provide a high-performance, low-power solution for network and intelligent applications. It is equipped with a wide range of features, such as high-speed, low-power operation, multi-core processing, and advanced security mechanisms. Additionally, it is designed to be compatible with a variety of existing and emerging technologies, including 5G, Wi-Fi, Bluetooth, and other wireless standards.
The XCV2000E-6FGG860I chip model is also designed to support the latest trends in the industry. It is capable of supporting a range of intelligent scenarios, such as machine learning, AI, and deep learning. Additionally, it is designed to be compatible with the latest technologies, such as the Internet of Things (IoT) and cloud computing. With its high performance and low power consumption, it is suitable for use in a range of applications.
In order to ensure the optimal performance of the XCV2000E-6FGG860I chip model, it is important to understand the product description and design requirements. This includes understanding the features and capabilities of the chip model, as well as the specific design requirements. Additionally, it is important to consider any potential challenges that may arise during the design process, such as power consumption and heat dissipation.
Finally, it is important to consider actual case studies and precautions when using the XCV2000E-6FGG860I chip model. This includes understanding the potential risks and benefits associated with the model, as well as any potential issues that may arise during its use. Additionally, it is important to consider the potential applications of the chip model, as well as its compatibility with existing and emerging technologies.
Overall, the XCV2000E-6FGG860I chip model is a versatile and powerful chip model that is designed to meet the needs of a variety of applications. It is capable of supporting a range of intelligent scenarios, as well as existing and emerging technologies. In order to ensure the optimal performance of the chip model, it is important to understand the product description and design requirements, as well as any potential challenges that may arise during its use. Additionally, it is important to consider actual case studies and precautions when using the chip model.
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