AMD Xilinx
XCV2000E-6FGG860C
XCV2000E-6FGG860C ECAD Model
XCV2000E-6FGG860C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV2000E-6FGG860C Datasheet Download
XCV2000E-6FGG860C Overview
The XCV2000E-6FGG860C chip model is a new development in the field of integrated circuit technology, providing a wide range of features and benefits that have been designed to meet the needs of various industries. This chip model is an advanced version of the XCV2000E series, which is a high-performance, low-power, multi-core processor. It offers a wide range of features, including a high-speed, low-power, multi-core architecture, enhanced memory and storage capabilities, and a wide range of I/O interfaces.
The XCV2000E-6FGG860C chip model offers a wide range of advantages, such as improved performance and power efficiency, improved memory and storage capabilities, and a wide range of I/O interfaces. These features make it suitable for a variety of applications, such as embedded systems, communications, and computer systems. In addition, the chip model is designed to be highly scalable, allowing for future upgrades and modifications.
The XCV2000E-6FGG860C chip model is designed to meet the specific needs of various industries. It offers a wide range of features, such as a high-speed, low-power, multi-core architecture, enhanced memory and storage capabilities, and a wide range of I/O interfaces. These features make it suitable for a variety of applications, such as embedded systems, communications, and computer systems. In addition, the chip model is designed to be highly scalable, allowing for future upgrades and modifications.
The XCV2000E-6FGG860C chip model is designed with a range of specific design requirements, such as a high-speed, low-power, multi-core architecture, enhanced memory and storage capabilities, and a wide range of I/O interfaces. These features make it suitable for a variety of applications, such as embedded systems, communications, and computer systems. In addition, the chip model is designed to be highly scalable, allowing for future upgrades and modifications.
The XCV2000E-6FGG860C chip model has been used in a variety of actual case studies, and its performance has been proven to be reliable and efficient. In addition, the chip model has been tested for compatibility with various communication systems, and it has been found to be able to handle advanced communication systems with ease.
When using the XCV2000E-6FGG860C chip model, it is important to keep in mind certain precautions. For example, it is important to ensure that the chip model is properly installed and configured. In addition, it is important to keep the chip model clean and free from dust and debris, as this can affect its performance. Finally, it is important to ensure that the chip model is used in accordance with the manufacturer's instructions.
In conclusion, the XCV2000E-6FGG860C chip model is a highly advanced and reliable integrated circuit technology that offers a wide range of features and benefits. It is designed to meet the specific needs of various industries, and it is highly scalable, allowing for future upgrades and modifications. In addition, the chip model has been tested for compatibility with various communication systems, and it has been found to be able to handle advanced communication systems with ease. When using the XCV2000E-6FGG860C chip model, it is important to keep in mind certain precautions, such as proper installation and configuration, and keeping the chip model clean and free from dust and debris. With its wide range of features and benefits, the XCV2000E-6FGG860C chip model is expected to remain in high demand in the future.
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5,450 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $390.6000 | $390.6000 |
| 10+ | $386.4000 | $3,864.0000 |
| 100+ | $365.4000 | $36,540.0000 |
| 1000+ | $344.4000 | $172,200.0000 |
| 10000+ | $315.0000 | $315,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||