AMD Xilinx
XCV2000E-7FGG860I
XCV2000E-7FGG860I ECAD Model
XCV2000E-7FGG860I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA860,42X42,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 860 |
XCV2000E-7FGG860I Datasheet Download
XCV2000E-7FGG860I Overview
The chip model XCV2000E-7FGG860I is a cutting-edge technology developed by a leading semiconductor manufacturer. It is designed to meet the needs of high-speed and low-power data processing in advanced communication systems. The XCV2000E-7FGG860I is a highly integrated chip model that combines multiple functional blocks and can be used in a variety of applications.
The XCV2000E-7FGG860I is designed to meet the needs of advanced communication systems. It is equipped with a powerful processor, a large memory, and a high-speed interface. It is also designed to be highly energy efficient, allowing it to be used in a wide range of applications. The XCV2000E-7FGG860I can be used in a variety of networks and intelligent scenarios, such as data centers, automotive systems, and Internet of Things (IoT) applications.
The XCV2000E-7FGG860I is designed to be highly upgradeable and is capable of supporting the latest technologies. It is capable of supporting the latest technologies, such as 5G, machine learning, and artificial intelligence. It is also capable of supporting new applications, such as autonomous driving, smart cities, and virtual reality.
The XCV2000E-7FGG860I is designed to be highly versatile, allowing it to be used in a variety of applications and intelligent scenarios. The XCV2000E-7FGG860I is capable of being used in the era of fully intelligent systems, allowing it to be used in autonomous driving, smart cities, and virtual reality applications. The XCV2000E-7FGG860I is designed to be highly energy efficient, allowing it to be used in a variety of applications and intelligent scenarios.
The XCV2000E-7FGG860I is a cutting-edge chip model that is designed to meet the needs of advanced communication systems. It is highly integrated, energy efficient, and upgradeable, allowing it to be used in a variety of applications and intelligent scenarios. The XCV2000E-7FGG860I is capable of supporting the latest technologies, such as 5G, machine learning, and artificial intelligence. It is also capable of being used in the era of fully intelligent systems, allowing it to be used in autonomous driving, smart cities, and virtual reality applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||