AMD Xilinx
XCV1600E-8FGG860I
XCV1600E-8FGG860I ECAD Model
XCV1600E-8FGG860I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-8FGG860I Datasheet Download
XCV1600E-8FGG860I Overview
The chip model XCV1600E-8FGG860I is a powerful and versatile integrated circuit (IC) that has been designed for use in a wide range of applications. It is a highly efficient, low-power chip with a wide range of features, including high-speed data processing and a wide range of communication protocols. It is a highly reliable and robust chip that can be used in a variety of applications, including communications, networking, and data processing.
The chip model XCV1600E-8FGG860I is designed to be used in a variety of communication systems, including wireless, cellular, and satellite networks. It can also be used in a variety of data processing applications, including machine learning, artificial intelligence, and big data. It is designed to be used in the era of fully intelligent systems, where it can be used to process large amounts of data quickly and accurately.
The chip model XCV1600E-8FGG860I is designed to be highly reliable and robust, and is capable of supporting a variety of new technologies. The chip is designed to be flexible and scalable, allowing for future upgrades and modifications as needed. It is also designed to be compatible with a wide range of communication protocols, making it suitable for use in a variety of networks.
The chip model XCV1600E-8FGG860I is designed to be used in a variety of intelligent scenarios, including machine learning, artificial intelligence, and big data. It is also capable of being used in advanced communication systems, such as those used for 5G networks. The chip model is designed to be highly reliable and robust, making it suitable for use in a variety of environments.
The chip model XCV1600E-8FGG860I is a powerful and versatile integrated circuit that is designed to be used in a variety of applications. It is designed to be highly reliable and robust, and is capable of supporting a variety of new technologies. It is also designed to be flexible and scalable, allowing for future upgrades and modifications as needed. The chip is also capable of being used in a variety of intelligent scenarios, including machine learning, artificial intelligence, and big data. Finally, it is capable of being used in advanced communication systems, such as those used for 5G networks. With its wide range of features and capabilities, the chip model XCV1600E-8FGG860I is sure to be an important part of the future of communication and intelligent systems.
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