AMD Xilinx
XCV1600E-8FGG860C
XCV1600E-8FGG860C ECAD Model
XCV1600E-8FGG860C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-8FGG860C Datasheet Download
XCV1600E-8FGG860C Overview
The chip model XCV1600E-8FGG860C is a high-performance digital signal processing processor that is suitable for embedded processing, image processing, and other applications. It requires the use of HDL language for programming. This chip is a powerful tool for developers and engineers, as it can be used for a variety of applications.
In terms of industry trends, this chip model is expected to be used in a wide range of fields, such as network infrastructure, automotive, industrial automation, and consumer electronics. It is also expected to be used in intelligent systems, such as smart homes, autonomous vehicles, and robotic systems. As new technologies emerge, the chip model will need to be adapted and upgraded to keep up with the latest developments.
As the chip model continues to evolve, it will become increasingly applicable to a variety of intelligent scenarios. It can be used to power autonomous vehicles, smart home systems, and other intelligent systems. It can also be used to enable faster and more efficient data processing and communication. This chip model is also expected to be used in the era of fully intelligent systems, where machines are able to make decisions on their own.
The chip model XCV1600E-8FGG860C is a powerful tool for developers and engineers, as it can be used for a variety of applications. It is expected to be used in a wide range of fields, from network infrastructure to consumer electronics. It is also expected to be used in intelligent systems, such as smart homes, autonomous vehicles, and robotic systems. As new technologies emerge, the chip model will need to be adapted and upgraded to keep up with the latest developments. With its powerful capabilities and wide range of applications, the chip model XCV1600E-8FGG860C is expected to be a key player in the future of intelligent systems.
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