AMD Xilinx
XCV1600E-7FGG860I
XCV1600E-7FGG860I ECAD Model
XCV1600E-7FGG860I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-7FGG860I Datasheet Download
XCV1600E-7FGG860I Overview
The chip model XCV1600E-7FGG860I is a powerful processor designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL language, which is an industry standard and is used in a wide range of applications. This chip model is designed to meet the needs of these applications, providing the necessary performance and features in a compact package.
The chip model XCV1600E-7FGG860I has a number of advantages that make it an attractive choice for many applications. It is capable of processing large amounts of data quickly and efficiently, making it ideal for applications that require high performance. It also has a low power consumption, making it ideal for battery-operated devices. Additionally, it is designed to be compatible with a wide range of software and hardware, making it easy to integrate into existing systems.
The chip model XCV1600E-7FGG860I is expected to be in high demand in the future, as the need for high performance digital signal processing, embedded processing, and image processing continues to grow. As new technologies are developed, the need for this chip model will likely increase as well. In addition, as applications become more complex, the need for more powerful processors will also increase. This chip model is designed to meet the needs of these applications, providing the necessary performance and features in a compact package.
Overall, the chip model XCV1600E-7FGG860I is a powerful and efficient processor that is designed to meet the needs of a wide range of applications. It is designed to be used with the HDL language, which is an industry standard and is used in a wide range of applications. It is capable of processing large amounts of data quickly and efficiently, making it ideal for applications that require high performance. Additionally, it is designed to be compatible with a wide range of software and hardware, making it easy to integrate into existing systems. As new technologies are developed and applications become more complex, the need for this chip model is expected to increase in the future.
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