AMD Xilinx
XCV1600E-7FGG860C
XCV1600E-7FGG860C ECAD Model
XCV1600E-7FGG860C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-7FGG860C Datasheet Download
XCV1600E-7FGG860C Overview
The XCV1600E-7FGG860C chip model is a powerful and versatile tool for a variety of applications, particularly in the realms of high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which makes it suitable for a wide range of applications.
The chip model is capable of being used in networks, such as for communication and data transfer. It can also be used in intelligent scenarios, such as for artificial intelligence and machine learning. With the increasing development of intelligent systems, this chip model can be used to develop and popularize future intelligent robots.
Using the XCV1600E-7FGG860C chip model effectively requires a certain level of technical expertise. Knowledge of HDL language is essential, as well as an understanding of how to use the chip model for specific applications. Additionally, a good understanding of the hardware and software components of the chip model is also necessary.
In conclusion, the XCV1600E-7FGG860C chip model is a powerful and versatile tool that can be used for a variety of applications, from high-performance digital signal processing to embedded processing and image processing. It can also be used in networks and intelligent scenarios, and is capable of being used in the development and popularization of future intelligent robots. To use the chip model effectively, technical expertise is required, including knowledge of the hardware and software components of the chip model as well as an understanding of HDL language.
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