AMD Xilinx
XCV1600E-6FGG860I
XCV1600E-6FGG860I ECAD Model
XCV1600E-6FGG860I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-6FGG860I Datasheet Download
XCV1600E-6FGG860I Overview
The XCV1600E-6FGG860I chip model is an advanced digital signal processor (DSP) with a high-performance embedded processing unit. It is suitable for a wide range of applications, such as digital signal processing, image processing, and other related tasks. It is designed to be used with the HDL language, which is a standard language for designing digital circuits.
The XCV1600E-6FGG860I chip model offers many advantages over other DSPs. It is designed to meet the needs of high-performance applications and is capable of handling large amounts of data. It is also designed to be energy efficient, which makes it suitable for use in battery-powered devices. Additionally, the chip model features a wide range of features, such as multiple memory banks, dual-core processing, and multiple clock speeds, which makes it suitable for a variety of applications.
In terms of the expected demand for the XCV1600E-6FGG860I chip model, the chip is expected to be in high demand in the coming years. This is due to the increasing demand for digital signal processing and embedded processing in the consumer electronics industry. As such, the chip model is expected to be widely used in a variety of applications, including consumer electronics, automotive, medical, and industrial applications.
In terms of product design and specific requirements of the XCV1600E-6FGG860I chip model, it is important to consider that the chip model is designed to be used in conjunction with the HDL language. This means that the chip model must be programmed in HDL in order to be used properly. Additionally, the chip model must be designed to meet the specific requirements of the application it is intended for. For example, if the chip is intended for use in an automotive application, it must be designed to meet the specific requirements of that application, such as safety and reliability.
In terms of actual case studies, the XCV1600E-6FGG860I chip model has been used in a variety of applications, including medical imaging, industrial automation, and consumer electronics. In each case, the chip model has been used to improve the performance and reliability of the application. Additionally, the chip model has been used in a variety of safety-critical applications, such as aircraft control systems and automotive systems, due to its robust design and reliable performance.
Finally, when designing applications with the XCV1600E-6FGG860I chip model, it is important to consider the safety and reliability of the system. As such, it is important to ensure that the chip model is designed to meet the specific requirements of the application and that the HDL code is written in a way that is safe and reliable. Additionally, it is important to ensure that the chip model is tested thoroughly before being used in any application.
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