
AMD Xilinx
XCV1600E-6FGG860C
XCV1600E-6FGG860C ECAD Model
XCV1600E-6FGG860C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 660 | |
Number of Outputs | 660 | |
Number of Logic Cells | 34992 | |
Number of Equivalent Gates | 419904 | |
Number of CLBs | 7776 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 7776 CLBS, 419904 GATES | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B860 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 860 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA860,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 2.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA860,42X42,40 | |
Pin Count | 860 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV1600E-6FGG860C Datasheet Download
XCV1600E-6FGG860C Overview
The XCV1600E-6FGG860C chip model is a high-performance device designed for digital signal processing, embedded processing, and image processing. It is capable of being programmed in HDL language, which is a hardware description language used to program digital systems. This makes the chip model highly versatile and suitable for various applications.
One of the major advantages of the XCV1600E-6FGG860C chip model is its ability to process data quickly and accurately. This makes it ideal for applications that require high-speed data processing, such as network security, image recognition, and artificial intelligence. In addition, the chip model is also highly energy efficient, making it suitable for applications where energy efficiency is a priority.
The demand for the XCV1600E-6FGG860C chip model is expected to grow in the future. This is due to the increasing demand for devices that can process data quickly and accurately. As the Internet of Things (IoT) and artificial intelligence become more prevalent, the need for devices that can process data quickly and accurately will also increase.
The XCV1600E-6FGG860C chip model can be used in networks and intelligent scenarios. It can be used in networks to provide secure and reliable data processing. It can also be used in intelligent scenarios, such as image recognition and artificial intelligence, to provide accurate and fast data processing.
The XCV1600E-6FGG860C chip model is also suitable for use in the era of fully intelligent systems. It can be used to process large amounts of data quickly and accurately, making it ideal for applications such as autonomous driving and natural language processing. This makes it a valuable tool for the future of intelligent systems.
In conclusion, the XCV1600E-6FGG860C chip model is an ideal device for digital signal processing, embedded processing, and image processing. It is highly energy efficient and capable of processing data quickly and accurately, making it suitable for a variety of applications. The demand for the chip model is expected to grow in the future as the need for devices that can process data quickly and accurately increases. The chip model can also be used in networks and intelligent scenarios, as well as in the era of fully intelligent systems.
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