
AMD Xilinx
XCV1000E-8FGG860I
XCV1000E-8FGG860I ECAD Model
XCV1000E-8FGG860I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 660 | |
Number of Outputs | 660 | |
Number of Logic Cells | 27648 | |
Number of Equivalent Gates | 331776 | |
Number of CLBs | 6144 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6144 CLBS, 331776 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B860 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 860 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA860,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 2.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA860,42X42,40 | |
Pin Count | 860 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV1000E-8FGG860I Datasheet Download
XCV1000E-8FGG860I Overview
The chip model XCV1000E-8FGG860I is a high-performance, low-power FPGA chip developed by a leading semiconductor company. It is widely used in various industries such as consumer electronics, automotive, and industrial applications. This chip model has a wide range of features and capabilities, making it suitable for a variety of applications.
The chip model XCV1000E-8FGG860I is designed to meet the needs of a wide range of industries, including consumer electronics, automotive, and industrial applications. It is equipped with advanced features such as high-speed transceivers, high-speed memory interfaces, and advanced logic blocks. This chip model also offers a wide range of I/O options, making it suitable for a variety of applications.
In terms of industry trends, the chip model XCV1000E-8FGG860I is expected to continue to be a popular choice for applications that require high-performance, low-power FPGA solutions. This chip model is expected to be used in a wide range of applications, including consumer electronics, automotive, and industrial applications. As the demand for advanced technologies grows, the chip model XCV1000E-8FGG860I is expected to continue to be a popular choice for applications that require high-performance, low-power FPGA solutions.
In terms of the application environment, the chip model XCV1000E-8FGG860I can be used in various applications that require high-performance, low-power FPGA solutions. It is suitable for applications such as consumer electronics, automotive, and industrial applications. This chip model is also suitable for applications that require support for new technologies, such as artificial intelligence and machine learning.
The chip model XCV1000E-8FGG860I can also be used for the development and popularization of future intelligent robots. This chip model is equipped with advanced features such as high-speed transceivers, high-speed memory interfaces, and advanced logic blocks. It is suitable for applications that require support for new technologies, such as artificial intelligence and machine learning. In order to use this chip model effectively, technical talent with knowledge of FPGA design, programming, and debugging is required.
In conclusion, the chip model XCV1000E-8FGG860I is a high-performance, low-power FPGA chip developed by a leading semiconductor company. It is widely used in various industries such as consumer electronics, automotive, and industrial applications. It is expected to continue to be a popular choice for applications that require high-performance, low-power FPGA solutions. It is also suitable for applications that require support for new technologies, such as artificial intelligence and machine learning. Furthermore, this chip model can also be used for the development and popularization of future intelligent robots. In order to use this chip model effectively, technical talent with knowledge of FPGA design, programming, and debugging is required.
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