AMD Xilinx
XCV1000E-8FGG860C
XCV1000E-8FGG860C ECAD Model
XCV1000E-8FGG860C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000E-8FGG860C Datasheet Download
XCV1000E-8FGG860C Overview
The XCV1000E-8FGG860C chip model is a powerful, high-performance digital signal processor that is suitable for a wide range of applications, including embedded processing, image processing, and more. To use this chip model, the HDL language must be employed.
In order to determine the industry trends of the XCV1000E-8FGG860C chip model and the future development of related industries, it is important to consider the specific technologies that are needed. For example, if the application environment requires the support of new technologies, then the XCV1000E-8FGG860C chip model may be the ideal solution.
In terms of possible future applications of the XCV1000E-8FGG860C chip model, it can be used in networks and various intelligent scenarios. As the world moves towards a fully intelligent system, the XCV1000E-8FGG860C chip model can be used to help facilitate this transition. This chip model can be used to process data quickly and accurately, making it ideal for a wide range of applications.
In conclusion, the XCV1000E-8FGG860C chip model is a powerful and versatile tool that can be used in a variety of applications. By using the HDL language, this chip model can be used to process data quickly and accurately, allowing it to be used in a variety of intelligent scenarios. As the world moves towards a fully intelligent system, the XCV1000E-8FGG860C chip model can be used to help facilitate this transition.
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2,357 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $624.9600 | $624.9600 |
| 10+ | $618.2400 | $6,182.4000 |
| 100+ | $584.6400 | $58,464.0000 |
| 1000+ | $551.0400 | $275,520.0000 |
| 10000+ | $504.0000 | $504,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||