AMD Xilinx
XCV1000E-7FGG860I
XCV1000E-7FGG860I ECAD Model
XCV1000E-7FGG860I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000E-7FGG860I Datasheet Download
XCV1000E-7FGG860I Overview
The XCV1000E-7FGG860I chip model is a high-performance, low-power device designed for digital signal processing (DSP), embedded processing, and image processing. It is capable of handling complex tasks with ease, and its design is optimized for use with the HDL language. The XCV1000E-7FGG860I chip model is a versatile device that can be used in a variety of applications, from high-end networking to intelligent scenarios.
The XCV1000E-7FGG860I chip model was designed with the goal of providing a reliable platform for advanced communication systems. It has the potential to be upgraded in the future, making it suitable for use in the era of fully intelligent systems. The chip model is capable of being used for high-performance networking, allowing for the transmission of large amounts of data in a short amount of time. It is also capable of being used in intelligent scenarios, such as machine learning and artificial intelligence.
The XCV1000E-7FGG860I chip model is a powerful device that can be used in a variety of scenarios. Its low-power design and ability to be upgraded make it an ideal choice for advanced communication systems. It is also capable of being used in intelligent scenarios, such as machine learning and artificial intelligence. The chip model is an excellent choice for those looking to utilize the latest in digital signal processing, embedded processing, and image processing technology.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||