AMD Xilinx
XCV1000E-7FGG860C
XCV1000E-7FGG860C ECAD Model
XCV1000E-7FGG860C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000E-7FGG860C Datasheet Download
XCV1000E-7FGG860C Overview
The XCV1000E-7FGG860C chip model is a powerful and versatile chip model designed by Xilinx to meet the ever-changing needs of the communication industry. It is designed to be used in high-speed communication systems, and can be used in a variety of applications, such as high-speed data processing, network security, and wireless communication.
The original design intention of the XCV1000E-7FGG860C chip model was to provide a reliable and efficient platform for communication systems. It is capable of providing high-speed data processing and network security, while also supporting the development of advanced communication systems. The chip model is also capable of supporting future upgrades, which can be used to improve the performance of the chip model and expand its capabilities.
The XCV1000E-7FGG860C chip model also has potential applications in the field of intelligent networks and intelligent scenarios. It can be used to develop and implement advanced communication systems that are capable of supporting intelligent networks, such as machine learning, artificial intelligence, and Internet of Things. The chip model also has the potential to be used in the era of fully intelligent systems, such as self-driving cars, automated factories, and smart homes.
The XCV1000E-7FGG860C chip model can also be applied to the development and popularization of future intelligent robots. The chip model is capable of supporting the development of robots with advanced features, such as autonomous navigation, object detection, and voice recognition. To effectively use the chip model, technical talents such as software engineers, hardware engineers, and roboticists are needed to develop and implement the necessary software and hardware components.
In conclusion, the XCV1000E-7FGG860C chip model is a powerful and versatile chip model that is designed to meet the ever-changing needs of the communication industry. It is capable of providing high-speed data processing and network security, while also supporting the development of advanced communication systems. The chip model also has potential applications in the field of intelligent networks and intelligent scenarios, and can be used to develop and implement robots with advanced features. To effectively use the chip model, technical talents such as software engineers, hardware engineers, and roboticists are needed.
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|---|---|---|
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