AMD Xilinx
XCV1000E-6FGG860I
XCV1000E-6FGG860I ECAD Model
XCV1000E-6FGG860I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000E-6FGG860I Datasheet Download
XCV1000E-6FGG860I Overview
The XCV1000E-6FGG860I chip model is a powerful and versatile model designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is a highly advanced model that requires the use of HDL language in order to take full advantage of its capabilities.
The original design intention of the XCV1000E-6FGG860I chip model was to provide a powerful and reliable solution for digital signal processing and embedded processing. The model is also designed to be easily upgradable, allowing users to take advantage of new technologies and features as they become available. Furthermore, the model is also suitable for advanced communication systems, making it a great choice for those looking to develop applications that require high-speed data transfer.
The XCV1000E-6FGG860I chip model is also suitable for the development and popularization of future intelligent robots. Its powerful capabilities make it an ideal choice for robotics applications, and its upgradable design allows users to take advantage of the latest technologies and features. In order to use the model effectively, technical talents such as software engineers, electrical engineers, and robotics experts are required.
Overall, the XCV1000E-6FGG860I chip model is a powerful and reliable solution for digital signal processing, embedded processing, image processing, and other applications. It is designed to be easily upgradable and suitable for advanced communication systems, and is also suitable for the development and popularization of future intelligent robots. In order to use the model effectively, technical talents such as software engineers, electrical engineers, and robotics experts are required.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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