AMD Xilinx
XCV1000E-6FGG860C
XCV1000E-6FGG860C ECAD Model
XCV1000E-6FGG860C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA860,42X42,40 | |
| Pin Count | 860 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000E-6FGG860C Datasheet Download
XCV1000E-6FGG860C Overview
The XCV1000E-6FGG860C chip model is an incredibly versatile and powerful model that can be used for a variety of applications. It is well-suited for high-performance digital signal processing, embedded processing, and image processing, and it requires the use of HDL language. It is also a great choice for those looking to use it in networks and intelligent systems.
The XCV1000E-6FGG860C chip model is designed to be a high-performance, low-power, and cost-effective solution for embedded applications. It has a wide range of features and capabilities, including a high-speed, low-latency processor, a large amount of memory, and a variety of I/O options. It is also compatible with a range of operating systems, including Linux and Windows.
When designing a system with the XCV1000E-6FGG860C chip model, it is important to consider the specific design requirements and the intended application. For example, if the application requires high-speed data processing, then a faster processor and more memory may be necessary. On the other hand, if the application is more focused on image processing, then a larger and more powerful processor may be needed. Additionally, the I/O options should be carefully considered to ensure that the system is able to communicate effectively with the other components.
When using the XCV1000E-6FGG860C chip model, it is important to consider the power requirements of the system. The chip model is designed to be low-power and energy-efficient, but it is still important to consider the power requirements of the system, especially if the system will be running for extended periods of time. Additionally, it is important to consider the scalability of the system, as the chip model is designed to be easily scalable and upgradeable.
There are a number of case studies and examples of the XCV1000E-6FGG860C chip model being used in real-world applications. For example, it has been used in a variety of medical imaging applications, such as CT scanners and MRI machines. Additionally, it has been used in a number of industrial automation applications, such as robotics and automated manufacturing.
In conclusion, the XCV1000E-6FGG860C chip model is an incredibly versatile and powerful model that can be used for a wide range of applications. It is well-suited for high-performance digital signal processing, embedded processing, and image processing, and it requires the use of HDL language. It is also a great choice for those looking to use it in networks and intelligent systems. When designing a system with the chip model, it is important to consider the specific design requirements and the intended application, as well as the power requirements and scalability of the system. Additionally, there are a number of case studies and examples of the chip model being used in real-world applications.
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4,295 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $279.0000 | $279.0000 |
| 10+ | $276.0000 | $2,760.0000 |
| 100+ | $261.0000 | $26,100.0000 |
| 1000+ | $246.0000 | $123,000.0000 |
| 10000+ | $225.0000 | $225,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||