
AMD Xilinx
XCV100-6FG256I
XCV100-6FG256I ECAD Model
XCV100-6FG256I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 176 | |
Number of Outputs | 176 | |
Number of Logic Cells | 2700 | |
Number of Equivalent Gates | 108904 | |
Number of CLBs | 600 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 600 CLBS, 108904 GATES | |
Clock Frequency-Max | 333 MHz | |
Power Supplies | 1.5/3.3,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCV100-6FG256I Datasheet Download
XCV100-6FG256I Overview
The XCV100-6FG256I chip model is a revolutionary product that has been developed to meet the needs of a wide range of industries. It is a cutting-edge model that combines high-performance, low-power, and high-density features, making it ideal for a variety of applications. It is designed to support a wide range of network architectures, such as Ethernet, Wi-Fi, and Bluetooth, as well as a wide range of intelligent scenarios.
The XCV100-6FG256I chip model is designed to provide a high level of performance with low power consumption. It is capable of handling multiple tasks simultaneously, which makes it suitable for a variety of applications. Additionally, the chip model has a high density of 256 megabits, allowing it to store and process large amounts of data efficiently. This makes it ideal for a variety of applications, such as machine learning, artificial intelligence, and cloud computing.
The XCV100-6FG256I chip model is a versatile and reliable product that can be used in a variety of applications. It is designed to be compatible with a wide range of networks, such as Ethernet, Wi-Fi, and Bluetooth. Additionally, it is capable of supporting a wide range of intelligent scenarios, such as autonomous vehicles, robotics, and the Internet of Things.
The XCV100-6FG256I chip model is designed to meet the specific design requirements of a variety of applications. It is designed to provide a high level of performance with low power consumption, as well as a high density of 256 megabits. Additionally, it is designed to be compatible with a wide range of networks, such as Ethernet, Wi-Fi, and Bluetooth, as well as a wide range of intelligent scenarios.
The XCV100-6FG256I chip model has been used in a variety of applications, such as autonomous vehicles, robotics, and the Internet of Things. Additionally, it has been used in a variety of case studies, such as the development of autonomous robots and the integration of artificial intelligence into existing systems. Furthermore, the XCV100-6FG256I chip model has been used to develop a variety of safety systems, such as autonomous vehicle safety systems and robotic safety systems.
When using the XCV100-6FG256I chip model, there are a few precautions that should be taken. It is important to ensure that the chip model is compatible with the intended application, as well as the intended network architecture. Additionally, it is important to ensure that the chip model is properly configured and that it meets the specific design requirements of the application. Finally, it is important to ensure that the chip model is properly tested before it is deployed in a production environment.
The XCV100-6FG256I chip model is a revolutionary product that has a variety of advantages and applications. It is designed to provide a high level of performance with low power consumption, as well as a high density of 256 megabits. Additionally, it is designed to be compatible with a wide range of networks, such as Ethernet, Wi-Fi, and Bluetooth, as well as a wide range of intelligent scenarios. Furthermore, it has been used in a variety of applications, such as autonomous vehicles, robotics, and the Internet of Things. As such, the XCV100-6FG256I chip model is expected to be in high demand in the future, as more applications and intelligent scenarios are developed.
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