XCV100-6FG256I
XCV100-6FG256I
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rohs

AMD Xilinx

XCV100-6FG256I


XCV100-6FG256I
F20-XCV100-6FG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-256
FBGA-256

XCV100-6FG256I ECAD Model


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XCV100-6FG256I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Inputs 176
Number of Outputs 176
Number of Logic Cells 2700
Number of Equivalent Gates 108904
Number of CLBs 600
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 600 CLBS, 108904 GATES
Clock Frequency-Max 333 MHz
Power Supplies 1.5/3.3,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-256
Pin Count 256
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCV100-6FG256I Datasheet Download


XCV100-6FG256I Overview



The XCV100-6FG256I chip model is a revolutionary product that has been developed to meet the needs of a wide range of industries. It is a cutting-edge model that combines high-performance, low-power, and high-density features, making it ideal for a variety of applications. It is designed to support a wide range of network architectures, such as Ethernet, Wi-Fi, and Bluetooth, as well as a wide range of intelligent scenarios.


The XCV100-6FG256I chip model is designed to provide a high level of performance with low power consumption. It is capable of handling multiple tasks simultaneously, which makes it suitable for a variety of applications. Additionally, the chip model has a high density of 256 megabits, allowing it to store and process large amounts of data efficiently. This makes it ideal for a variety of applications, such as machine learning, artificial intelligence, and cloud computing.


The XCV100-6FG256I chip model is a versatile and reliable product that can be used in a variety of applications. It is designed to be compatible with a wide range of networks, such as Ethernet, Wi-Fi, and Bluetooth. Additionally, it is capable of supporting a wide range of intelligent scenarios, such as autonomous vehicles, robotics, and the Internet of Things.


The XCV100-6FG256I chip model is designed to meet the specific design requirements of a variety of applications. It is designed to provide a high level of performance with low power consumption, as well as a high density of 256 megabits. Additionally, it is designed to be compatible with a wide range of networks, such as Ethernet, Wi-Fi, and Bluetooth, as well as a wide range of intelligent scenarios.


The XCV100-6FG256I chip model has been used in a variety of applications, such as autonomous vehicles, robotics, and the Internet of Things. Additionally, it has been used in a variety of case studies, such as the development of autonomous robots and the integration of artificial intelligence into existing systems. Furthermore, the XCV100-6FG256I chip model has been used to develop a variety of safety systems, such as autonomous vehicle safety systems and robotic safety systems.


When using the XCV100-6FG256I chip model, there are a few precautions that should be taken. It is important to ensure that the chip model is compatible with the intended application, as well as the intended network architecture. Additionally, it is important to ensure that the chip model is properly configured and that it meets the specific design requirements of the application. Finally, it is important to ensure that the chip model is properly tested before it is deployed in a production environment.


The XCV100-6FG256I chip model is a revolutionary product that has a variety of advantages and applications. It is designed to provide a high level of performance with low power consumption, as well as a high density of 256 megabits. Additionally, it is designed to be compatible with a wide range of networks, such as Ethernet, Wi-Fi, and Bluetooth, as well as a wide range of intelligent scenarios. Furthermore, it has been used in a variety of applications, such as autonomous vehicles, robotics, and the Internet of Things. As such, the XCV100-6FG256I chip model is expected to be in high demand in the future, as more applications and intelligent scenarios are developed.



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