AMD Xilinx
XCR3512XL-12FT256C
XCR3512XL-12FT256C ECAD Model
XCR3512XL-12FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 512 | |
| Number of I/O Lines | 212 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 212 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 77 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3512XL-12FT256C Datasheet Download
XCR3512XL-12FT256C Overview
The XCR3512XL-12FT256C chip model is a high-performance, versatile chip designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL (Hardware Description Language) language, which is a powerful language for designing and programming digital logic circuits.
The XCR3512XL-12FT256C chip model is an advanced chip with a wide range of features and capabilities. It has 256-bit internal memory, 12-bit external memory, and a wide range of I/O ports. It supports a variety of communication protocols, including USB, Ethernet, and CAN bus. It also supports a range of programming languages, including Verilog, VHDL, and C.
In terms of its application scenarios, the XCR3512XL-12FT256C chip model is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is also suitable for the development and popularization of future intelligent robots. To use the model effectively, engineers need to have a good understanding of the HDL language, as well as the specific design requirements of the chip model.
Case studies of the XCR3512XL-12FT256C chip model can help engineers understand how to use the model effectively. In addition, it is important to be aware of the potential risks associated with using the model, such as the possibility of data corruption or incorrect operation.
In conclusion, the XCR3512XL-12FT256C chip model is a powerful, versatile chip model that is suitable for a variety of applications, including the development and popularization of future intelligent robots. To use the model effectively, engineers need to have a good understanding of the HDL language, as well as the specific design requirements of the chip model. In addition, case studies and potential risks associated with the chip model should be taken into consideration.
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3,858 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $69.2293 | $69.2293 |
| 10+ | $68.4849 | $684.8489 |
| 100+ | $64.7629 | $6,476.2887 |
| 1000+ | $61.0409 | $30,520.4410 |
| 10000+ | $55.8301 | $55,830.0750 |
| The price is for reference only, please refer to the actual quotation! | ||