AMD Xilinx
XCR3512XL-10FTG256C
XCR3512XL-10FTG256C ECAD Model
XCR3512XL-10FTG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 10 ns | |
| Number of Macro Cells | 512 | |
| Number of I/O Lines | 212 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 212 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 97 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCR3512XL-10FTG256C Datasheet Download
XCR3512XL-10FTG256C Overview
The XCR3512XL-10FTG256C chip model is a powerful and efficient model that has been designed to meet the needs of various industries. It is a low-power, high-performance FPGA device that offers a wide range of features and capabilities. It is suitable for applications that require high-speed data transfers and high-performance processing. The chip model also offers a wide range of I/O options, allowing for easy integration into existing systems.
The XCR3512XL-10FTG256C chip model has been designed to provide a reliable and cost-effective solution for many applications. It has been designed to provide a high-performance, low-cost solution for a wide range of applications, including embedded systems, industrial control, medical imaging, and automotive control. The chip model also offers a wide range of features and capabilities, including high-speed data transfer, high-performance processing, and low-power consumption.
The XCR3512XL-10FTG256C chip model is expected to see increasing demand in the future, as more industries and applications require high-performance solutions. The chip model is expected to be used in a wide range of applications, including industrial control, medical imaging, automotive control, and more. The chip model is also expected to be used in more advanced communication systems, as the need for higher performance and more efficient solutions increases.
The original design intention of the XCR3512XL-10FTG256C chip model was to provide a reliable and cost-effective solution for many applications. The chip model was designed to provide a high-performance, low-cost solution for a wide range of applications, including embedded systems, industrial control, medical imaging, and automotive control. The chip model also offers a wide range of features and capabilities, including high-speed data transfer, high-performance processing, and low-power consumption.
The XCR3512XL-10FTG256C chip model is expected to be upgraded in the future, as new technologies become available. The chip model is expected to be able to take advantage of new technologies, such as improved memory, faster data transfer speeds, and more efficient processing. This will enable the chip model to be used in more advanced communication systems, as the need for higher performance and more efficient solutions increases.
In conclusion, the XCR3512XL-10FTG256C chip model is a powerful and efficient model that has been designed to meet the needs of various industries. It is a low-power, high-performance FPGA device that offers a wide range of features and capabilities. It is suitable for applications that require high-speed data transfers and high-performance processing. The chip model is expected to see increasing demand in the future, as more industries and applications require high-performance solutions. The chip model is also expected to be upgraded in the future, as new technologies become available, enabling it to be used in more advanced communication systems.
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3,781 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $81.0962 | $81.0962 |
| 10+ | $80.2242 | $802.2418 |
| 100+ | $75.8642 | $7,586.4174 |
| 1000+ | $71.5042 | $35,752.0820 |
| 10000+ | $65.4002 | $65,400.1500 |
| The price is for reference only, please refer to the actual quotation! | ||