AMD Xilinx
XC6VSX475T-L1FF1759C
XC6VSX475T-L1FF1759C ECAD Model
XC6VSX475T-L1FF1759C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 476160 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VSX475T-L1FF1759C Datasheet Download
XC6VSX475T-L1FF1759C Overview
The chip model XC6VSX475T-L1FF1759C is a powerful and versatile integrated circuit that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a hardware description language that allows developers to create complex digital systems.
The industry trends of the chip model XC6VSX475T-L1FF1759C are largely dependent on the specific technologies that are needed for its application environment. In order to maximize its potential, developers must stay up to date with the latest advancements in technology and be able to apply them to the chip model.
The chip model XC6VSX475T-L1FF1759C can be used to develop and popularize future intelligent robots. To use the model effectively, developers must have a deep understanding of the chip's capabilities and be familiar with the HDL language. Additionally, they must be comfortable working with a wide range of hardware components, such as sensors, motors, and microcontrollers.
Overall, the chip model XC6VSX475T-L1FF1759C is a powerful and versatile integrated circuit that can be used in a variety of applications. To use it effectively, developers must be knowledgeable in the HDL language and have a deep understanding of the chip's capabilities. Additionally, they must be comfortable working with a wide range of hardware components. With the right knowledge and skillset, developers can use the chip model to develop and popularize future intelligent robots.
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